公开(公告)号：US20230411074A1

公开(公告)日：2023-12-21

申请号：US17983776

申请日：2022-11-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eui Hyun JO ,  Jin Soo PARK ,  Chul Seung LEE ,  Byung Jun JEON ,  Hyung Jong CHOI ,  Hyun Hee GU ,  Woo Kyung SUNG ,  Myung Jun PARK

IPC: H01G4/008 ,  H01G4/30

CPC classification number: H01G4/0085 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.

公开(公告)号：US20230215653A1

公开(公告)日：2023-07-06

申请号：US17890615

申请日：2022-08-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ha Jeong KIM ,  Kangha LEE ,  Jun Hyeong KIM ,  Eui Hyun JO ,  Myung Jun PARK

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G2/06

CPC classification number: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G2/065

Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

公开(公告)号：US20200082987A1

公开(公告)日：2020-03-12

申请号：US16184674

申请日：2018-11-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo LEE ,  Hyun Hee GU ,  Eui Hyun JO ,  Jong Ho LEE ,  Eun Jin KIM ,  Hye Young CHOI

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/12

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 μm to 1 μm, and a second plating portion disposed on the first plating portion.

公开(公告)号：US20230386750A1

公开(公告)日：2023-11-30

申请号：US18125868

申请日：2023-03-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Soo PARK ,  Eui Hyun JO ,  Hyun Hee GU

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in a third direction, first and second external electrodes including first and second plating layers disposed on the third and fourth surfaces, respectively and first and second electrode layers disposed on the first and second plating layers, respectively, first and second band electrodes disposed on the first surface and connected to the first and second external electrode, respectively. The first and second electrode layers do not contain glass.

公开(公告)号：US20200006001A1

公开(公告)日：2020-01-02

申请号：US16171903

申请日：2018-10-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Ho LEE ,  Eui Hyun JO ,  Jang Yeol LEE ,  Myung Jun PARK ,  Hyun Hee GU

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248

Abstract: A multilayer ceramic capacitor includes a body and an external electrode on the body. The body includes a dielectric layer and an internal electrode. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion on the electrode layer, and a second plating portion on the first plating portion. The first plating portion includes a plurality of plating layers in which a tin (Sn)-plated layer and a nickel (Ni)-plated layer are alternately stacked.

公开(公告)号：US20230230765A1

公开(公告)日：2023-07-20

申请号：US18081079

申请日：2022-12-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Soo PARK ,  Eui Hyun JO ,  Jun Hyeong KIM ,  Ha Jeong KIM ,  Hyun Hee GU ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Byung Jun JEON ,  Chul Seung LEE

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/008 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

公开(公告)号：US20200075248A1

公开(公告)日：2020-03-05

申请号：US16372782

申请日：2019-04-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Young CHOI ,  Jong Ho LEE ,  Eui Hyun JO ,  Jang Yeol LEE ,  Jin Woo LEE ,  Hyun Hee GU

IPC: H01G4/232 ,  H01G4/30 ,  H05K1/18

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.