公开(公告)号：US08936737B2

公开(公告)日：2015-01-20

申请号：US13670970

申请日：2012-11-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hyo Sub Kim ,  Jeong Ryeol Kim ,  Chang Hoon Kim ,  Gun Woo Kim ,  Doo Young Kim

IPC: H01B1/16 ,  H01B1/22 ,  B05D5/12 ,  H01B1/02 ,  H01G4/008 ,  H01C10/00 ,  H02N2/00 ,  B82Y30/00 ,  C09D11/52 ,  H01L41/047 ,  H01L41/273 ,  H01G4/30 ,  H01F17/00 ,  H01G4/12

CPC classification number: H01B1/02 ,  B82Y30/00 ,  C09D11/037 ,  C09D11/52 ,  H01B1/22 ,  H01C10/00 ,  H01F17/0013 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/30 ,  H01L41/0471 ,  H01L41/0477 ,  H01L41/273 ,  H02N2/00 ,  Y10S977/773 ,  Y10S977/81 ,  Y10S977/811

Abstract: There are provided a conductive paste for internal electrodes, a multilayer ceramic electronic component including the same, and a method of manufacturing the same. The conductive paste for internal electrodes including: a nickel (Ni) powder; a nickel oxide (NiO) powder having a content of 5.0 to 15.0 parts by weight based on 100 parts by weight of the nickel powder; and an organic vehicle.

Abstract translation: 提供内部电极用导电性糊剂，包含该导电性糊料的多层陶瓷电子部件及其制造方法。 用于内部电极的导电膏包括：镍（Ni）粉末; 相对于镍粉100重量份，含有5.0〜15.0重量份的氧化镍（NiO）粉末; 和有机车辆。

公开(公告)号：US20150129289A1

公开(公告)日：2015-05-14

申请号：US14536384

申请日：2014-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gun Woo Kim ,  Eung Suek Lee ,  Yoong Oh ,  Sung Uk Lee

IPC: H05K1/09 ,  H05K1/11

CPC classification number: H05K3/182 ,  H05K3/06 ,  H05K3/184 ,  H05K2203/0557 ,  H05K2203/1105 ,  H05K2203/1344

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a substrate; a metal root layer formed by injecting and depositing metal particles into and on the substrate; and a circuit layer formed on the metal root layer.

Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括：基板; 通过将金属颗粒注入并沉积在基底上而形成的金属根层; 以及形成在金属根层上的电路层。