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公开(公告)号：US20140102766A1
公开(公告)日：2014-04-17
申请号：US13831534
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Da Hee Kim , Yoong Oh , Ki Young Yoo , Han Ul Lee , Myung Sam Kang , Ki Hwan Kim
CPC classification number: H05K3/46 , H05K1/0298 , H05K3/4647 , H05K3/4682 , H05K2203/025 , H05K2203/0733 , Y10T29/49155
Abstract: Disclosed herein is a multi-layer type coreless substrate, including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated on one surface or both surfaces of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting a pillar disposed on an outermost insulating layer of the plurality of insulating layers.
Abstract translation: 本文公开了一种多层型无芯基板，包括：第一绝缘层，其包括至少一个第一柱; 层叠在第一绝缘层的一个表面或两个表面上的多个绝缘层，每个绝缘层包括至少一个电路层和至少另一个连接到电路层的柱; 以及与设置在所述多个绝缘层的最外绝缘层上的柱接触的多个最外层电路层。
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公开(公告)号：US09736939B2
公开(公告)日：2017-08-15
申请号：US14848907
申请日：2015-09-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Suk Hyeon Cho , Yong Ho Baek , Young Gwan Ko , Yoong Oh , Young Kuk Ko
CPC classification number: H05K1/115 , H05K1/0271 , H05K3/007 , H05K3/422 , H05K3/4605 , H05K3/4608 , H05K3/4682 , H05K2201/09827
Abstract: A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.
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3.发明申请公开(公告)号：US20140102767A1
公开(公告)日：2014-04-17
申请号：US13845092
申请日：2013-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam Kang , Ki Hwan Kim , Yong Yoon Cho , Sung Won Jeong , Sang Hyuck Oh , Da Hee Kim , Yoong Oh , Ki Young Yoo
CPC classification number: H05K1/0298 , H05K3/0064 , H05K3/007 , H05K3/0097 , H05K3/146 , H05K3/243 , H05K3/26 , H05K3/4647 , H05K3/4661 , H05K3/467 , H05K3/4682 , H05K2201/096 , H05K2203/0591 , H05K2203/1338 , H05K2203/1461
Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.
Abstract translation: 本文公开了一种多层型印刷电路板，包括： 包括至少一个第一柱的第一绝缘层; 在所述第一绝缘层的两个表面方向上层叠的多个绝缘层，每个绝缘层包括至少一个电路层和至少另一个连接到所述电路层的柱; 以及多个最外层电路层，其设置在最外绝缘层的外表面上，同时接触设置在多个绝缘层中的最外绝缘层上的最外层柱，其中电路层和另一柱形成在两个表面方向上 所述第一绝缘层基于所述第一绝缘层以彼此对称的形式设置。
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公开(公告)号：US11297714B2
公开(公告)日：2022-04-05
申请号：US17070289
申请日：2020-10-14
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Young-Kuk Ko , Yoong Oh , Sang-Hoon Kim , Gyu-Mook Kim , Yong-Soon Jang , Hea-Sung Kim
Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.
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公开(公告)号：US09736927B2
公开(公告)日：2017-08-15
申请号：US14875241
申请日：2015-10-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Suk Hyeon Cho , Yoong Oh , Young Gwan Ko , Yong Ho Baek , Young Kuk Ko
IPC: H05K1/02 , H05K1/03 , H05K1/11 , H05K3/06 , H05K3/40 , H05K3/46 , H05K1/18 , H05K3/00 , H05K3/42
CPC classification number: H05K1/0271 , H01L2224/16227 , H01L2924/15313 , H01L2924/15788 , H05K1/038 , H05K1/115 , H05K1/181 , H05K3/002 , H05K3/0029 , H05K3/0047 , H05K3/0052 , H05K3/429 , H05K3/4605 , H05K2201/0187 , H05K2201/0195 , H05K2201/0909 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2201/09854 , H05K2201/10674
Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.
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Patent Agency Ranking
公开(公告)号：US20140014398A1
公开(公告)日：2014-01-16
申请号：US13650050
申请日：2012-10-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
Inventor： Ki Hwan Kim , Myung Sam Kang , Da Hee Kim , Yoong Oh
CPC classification number: H05K3/4682
Abstract: Disclosed herein is a coreless substrate according to a preferred embodiment of the present invention, the coreless substrate including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a direction of one surface or both surfaces of the first insulating layer, including at least one circuit layer and at least one another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers.
Abstract translation: 本文公开了根据本发明优选实施例的无芯基板，所述无芯基板包括：第一绝缘层，其包括至少一个第一支柱; 在所述第一绝缘层的一个表面或两个表面的方向上层叠的多个绝缘层，包括至少一个电路层和至少一个连接到所述电路层的柱; 以及与设置在所述多个绝缘层中的最外侧绝缘层上的最外侧柱接触的多个最外侧电路层。
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公开(公告)号：US11088089B2
公开(公告)日：2021-08-10
申请号：US16680998
申请日：2019-11-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yoong Oh , Sang Hoon Kim , Young Kuk Ko , Yong Soon Jang
IPC: H01L23/00 , H01L23/31 , H01L23/538 , H01L23/14 , H01L23/498 , H01L23/13 , H01L23/48 , H01L23/522 , H01L23/485 , H01L23/525 , H01L21/56
Abstract: A package substrate includes a wiring substrate comprising an insulating layer, a first wiring layer, and a second wiring layer, wherein the first wiring layer comprises a first pad pattern, and the second wiring layer comprises a second pad pattern; a first passivation layer disposed on the insulating layer, and having a first opening portion passing through a region corresponding to at least a portion of the first pad pattern; a second passivation layer disposed on the insulating layer, and having a second opening portion passing through a region corresponding to at least a portion of the second pad pattern; and a reinforcing layer disposed on the second passivation layer, and having a through portion exposing the second opening portion. An upper surface of the first wiring layer is located in a position higher than a position of the lower surface of the insulating layer.
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公开(公告)号：US10991647B2
公开(公告)日：2021-04-27
申请号：US16658288
申请日：2019-10-21
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yoong Oh , Sang-Hoon Kim , Hea-Sung Kim , Gyu-Mook Kim , Young-Kuk Ko
IPC: H01L23/498 , H01L25/00 , H01L21/48
Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.
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公开(公告)号：US20150129289A1
公开(公告)日：2015-05-14
申请号：US14536384
申请日：2014-11-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Gun Woo Kim , Eung Suek Lee , Yoong Oh , Sung Uk Lee
CPC classification number: H05K3/182 , H05K3/06 , H05K3/184 , H05K2203/0557 , H05K2203/1105 , H05K2203/1344
Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a substrate; a metal root layer formed by injecting and depositing metal particles into and on the substrate; and a circuit layer formed on the metal root layer.
Abstract translation: 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括：基板; 通过将金属颗粒注入并沉积在基底上而形成的金属根层; 以及形成在金属根层上的电路层。
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公开(公告)号：US12224235B2
公开(公告)日：2025-02-11
申请号：US18211093
申请日：2023-06-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Hoon Ko , Sang Hoon Kim , Yoong Oh , Hea Sung Kim
IPC: H05K1/11 , H01L23/498
Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.
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