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    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
    电阻元件及其制造方法

    公开(公告)号：US20160172084A1

    公开(公告)日：2016-06-16

    申请号：US14953940

    申请日：2015-11-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jung Min NAM ,  Jea Hoon LEE ,  Young Key KIM ,  Hae In KIM

    IPC: H01C1/142 ,  H01C17/06 ,  H01C17/28 ,  H01C1/012

    CPC classification number: H01C1/142 ,  H01C1/01 ,  H01C1/012 ,  H01C17/006 ,  H01C17/281

    Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

    Abstract translation: 电阻元件包括基底基板，设置在基底基板的一个表面上的电阻层，设置在彼此间隔开的电阻层上的第一电极层和第二电极层，设置在第一电极层 并且所述第二电极层与所述第一电极层和所述第二电极层间隔开并且比所述第一电极层和所述第二电极层中的每一个均厚，以及设置在所述第一至第三电极层上的第一至第三镀层， 分别。

    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电阻元件及其制造方法

    公开(公告)号：US20160172083A1

    公开(公告)日：2016-06-16

    申请号：US14938716

    申请日：2015-11-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Key KIM ,  Jea Hoon LEE ,  Jung Min NAM ,  Hae In KIM

    IPC: H01C1/142 ,  H01C17/06 ,  H01C17/28 ,  H01C1/012

    CPC classification number: H01C1/142 ,  H01C1/012 ,  H01C7/003 ,  H01C17/06 ,  H01C17/283

    Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

    Abstract translation: 电阻元件包括基底基板，设置在基底基板的一个表面上的电阻层，设置在电阻层上彼此间隔开的第一电极层和第二电极层，设置在第一电极层之间的第三电极层 电极层和与第一电极层和第二电极层间隔开的第二电极层，设置在第三电极层的至少一端的导电树脂电极和设置在第一至第三电极层上的第一至第三电镀层 电极层。

    ARRAY TYPE CHIP RESISTOR AND METHOD OF MANUFACTURING THEREOF
    4.
    发明申请
    ARRAY TYPE CHIP RESISTOR AND METHOD OF MANUFACTURING THEREOF 有权
    阵列型芯片电阻及其制造方法

    公开(公告)号：US20140361405A1

    公开(公告)日：2014-12-11

    申请号：US14018801

    申请日：2013-09-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jung Il KIM ,  Ha Sung HWANG ,  Hae In KIM ,  Ichiro TANAKA ,  Oh Sung KWON

    IPC: H01L49/02

    CPC classification number: H01L28/20 ,  H01C1/01 ,  H01C1/14 ,  H01C1/142 ,  H01C7/003 ,  H01C17/281 ,  H01L28/24

    Abstract: There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.

    Abstract translation: 提供了一种阵列式芯片电阻器，包括：芯片体，设置在芯片体的下表面的两侧的四对下电极，并且形成为延伸到芯片主体的边缘，形成为使得 下部电极延伸到芯片主体的侧面，并且电阻器插入在芯片主体的下表面上的下部电极之间，并通过接触部分电连接到下部电极，其中当限定侧面电极的宽度时 作为d1，将相邻的侧面电极之间的距离定义为d2，将侧面电极的高度定义为h，在d1 / d2为0.5〜1.5的情况下，h的值为4300 /d1μm以上 为0.24d2 +87.26μm以下。

    COMPOSITE ELECTRONIC COMPONENT
    5.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200005998A1

    公开(公告)日：2020-01-02

    申请号：US16168038

    申请日：2018-10-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hae In KIM ,  Eun Ju OH ,  Yong Sung KIM

    IPC: H01G4/12 ,  H01G2/06 ,  H01G2/22 ,  H01G4/012 ,  H05K1/18 ,  H01G4/30 ,  H01G4/40

    Abstract: A composite electronic component includes a capacitor including a capacitor body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween, and first and second electrodes disposed on the capacitor body, and a varistor including a varistor body including ZnO and third and fourth electrodes disposed on the varistor body, wherein the first electrode is electrically connected to the third electrode and the second electrode is electrically connected to the fourth electrode.

    RESISTOR ELEMENT AND RESISTOR ELEMENT ASSEMBLY
    6.
    发明申请
    RESISTOR ELEMENT AND RESISTOR ELEMENT ASSEMBLY 有权

    公开(公告)号：US20180061533A1

    公开(公告)日：2018-03-01

    申请号：US15464649

    申请日：2017-03-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kwang Hyun PARK ,  Hae In KIM

    IPC: H01C1/06 ,  H01C1/14 ,  H01C1/012

    CPC classification number: H01C1/06 ,  H01C1/012 ,  H01C1/14

    Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor layer, respectively; a third terminal disposed between the first terminal and the second terminal on the second surface of the base substrate and spaced apart from the first terminal and the second terminal; and electrostatic discharge (ESD)-preventing members connecting the first terminal and the third terminal to each other and connecting the second terminal and the third terminal to each other.

    VARISTOR AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    VARISTOR AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20200168372A1

    公开(公告)日：2020-05-28

    申请号：US16570047

    申请日：2019-09-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ic Seob KIM ,  Jung Il KIM ,  Yong Sung KIM ,  Hae In KIM

    IPC: H01C7/12 ,  H01C1/14 ,  H01C1/02 ,  H01C13/02 ,  H01C17/065

    Abstract: A varistor includes a substrate; first and second electrodes disposed on an upper side and a lower side of the substrate, respectively; a core varistor body surrounded by the substrate and disposed between the first and second electrodes; first and second terminals having at least portions disposed on one side and the other side of the substrate, respectively, and electrically connected to the first and second electrodes, respectively; and a cover varistor body covering the core varistor body and disposed in a level higher than an upper surface of the substrate or disposed in a level lower than a lower surface of the substrate.

    MULTI-TERMINAL ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND BOARD HAVING THE SAME
    10.
    发明申请
    MULTI-TERMINAL ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND BOARD HAVING THE SAME 有权
    多端子电子元件及其制造方法和具有该多个电子元件的板

    公开(公告)号：US20160099093A1

    公开(公告)日：2016-04-07

    申请号：US14672040

    申请日：2015-03-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hoon LEE ,  Jung Min NAM ,  Young Key KIM ,  Hae In KIM

    IPC: H01C1/148 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/181 ,  H01C1/012 ,  H01C1/142 ,  H05K1/111 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.

    Abstract translation: 多端子电子部件包括：基材; 设置在所述基材的表面上的电阻层; 第一端子和第二端子，分别设置成彼此间隔开，同时覆盖电阻层的部分; 以及第三端子，其设置在所述第一端子和所述第二端子之间并且覆盖所述电阻层的一部分，其中所述基材相对的第一和第二侧表面从所述第一至第三端子露出。

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