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    DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT CONTAINING THE SAME
    1.
    发明申请
    DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT CONTAINING THE SAME 审中-公开

    公开(公告)号：US20190304686A1

    公开(公告)日：2019-10-03

    申请号：US16115049

    申请日：2018-08-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Hyung KANG ,  Hyung Kyu KIM ,  Jong Hyun CHO ,  Du Won CHOI ,  Yong Koo KIM ,  Hang Kyu CHO

    IPC: H01G4/12 ,  H01G4/30 ,  H01G4/008 ,  C04B35/468

    Abstract: A dielectric composition contains: a base material powder containing BamTiO3 (0.995≤m≤1.010); a first accessory ingredient containing at least one element corresponding to a transition metal in Group 5 of the periodic table in a total content of 0.3 to 1.2 moles; a second accessory ingredient containing one of ions, oxides, carbides, and hydrates of Si in a content of 0.6 to 4.5 moles; a third accessory ingredient containing at least one element in Period 4 or higher; and a fourth accessory ingredient containing at least one element in Period 3, wherein 0.70×B≤C+D≤1.50×B and 0.20≤D/(C+D)≤0.80, in which B is a total content of the second accessory ingredient, C is a total content of the third accessory ingredient, and D is a total content of the fourth accessory ingredient.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20150318110A1

    公开(公告)日：2015-11-05

    申请号：US14335674

    申请日：2014-07-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Ho LEE ,  Hang Kyu CHO ,  Doo Young KIM ,  Chung Eun LEE ,  Chul Seung LEE

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/248 ,  H01G4/012

    CPC classification number: H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode.

    Abstract translation: 多层陶瓷电子部件可以包括：陶瓷体，其包括交替设置电介质层和内部电极的有源部，设置在有源部的上部的上盖部，以及设置在下部的下盖部 的; 第一虚拟电极，其设置在长度方向上的上部或下部盖部的中央部与盖部的长度方向的一个端面之间; 以及第二虚拟电极，其设置在长度方向上的上盖部件的中央部分和盖部件的长度方向的另一端面之间，并且与第一虚拟电极间隔开。

    CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    芯片电子元件及其制造方法

    公开(公告)号：US20150028983A1

    公开(公告)日：2015-01-29

    申请号：US14261988

    申请日：2014-04-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Han Wool RYU ,  Gwang Hwan HWANG ,  Kwi Jong LEE ,  Hwan Soo LEE ,  Hang Kyu CHO

    IPC: H01F27/255 ,  H01F27/28 ,  H01F41/02 ,  H01F27/29

    CPC classification number: H01F1/15308 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  Y10T29/49155

    Abstract: A magnetic paste composition for a chip electronic component, a chip electronic component, and a manufacturing method therof are provided. The chip electronic component is capable of being manufactured in a thin-film to allow for thinness and miniaturization thereof, thereby preventing a deterioration in efficiency thereof due to core loss even under high frequency and high current conditions. The chip electronic component exhibits high permeability, high efficiency, and a high Isat value by decreasing porosity.

    Abstract translation: 提供了一种用于芯片电子部件的磁性糊剂组合物，芯片电子部件和制造方法。 芯片电子部件能够以薄膜制造以允许其薄型化和小型化，从而即使在高频和高电流条件下也能防止由于铁损而导致的效率的劣化。 芯片电子元件通过降低孔隙率表现出高渗透性，高效率和高Isat值。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20140125194A1

    公开(公告)日：2014-05-08

    申请号：US13715974

    申请日：2012-12-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Ho LEE ,  Jae Yeol CHOI ,  Doo Young KIM ,  Hang Kyu CHO ,  Eung Soo KIM ,  Byung Woo HAN

    IPC: H01G4/12 ,  H01C7/00 ,  H01C7/10 ,  H01F17/00 ,  H01L41/083

    CPC classification number: H01G2/103 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0472 ,  H01L41/0533

    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance.

    Abstract translation: 多层陶瓷电子部件包括：陶瓷体，包括电介质层; 形成在陶瓷体的一个表面上的氧化膜; 在陶瓷体的一个表面上形成在氧化膜两侧的第一和第二外部电极; 第一内部电极，其形成在所述电介质层上，并且包括暴露于所述第一外部电极的第一电极引出部分和暴露于所述氧化膜的第一绝缘引出部分，并且具有形成在暴露于所述第一外部电极的复合金属氧化物区域 其边缘部分; 面对第一内部电极的第二内部电极，其间具有电介质层，并且包括暴露于第二外部电极的第二电极引出部分和暴露于氧化物膜的第二绝缘引出部分， 金属氧化物区域形成在其暴露的边缘部分中，并且与第一绝缘引出部分重叠以形成额外的电容。

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