公开(公告)号：US20200176186A1

公开(公告)日：2020-06-04

申请号：US16566238

申请日：2019-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kook Joo MOON ,  Mi Young KIM ,  Doo Yeon HWANG ,  Jin Kyung JOO ,  Ho Jun LEE ,  Gam Woo KIM ,  Chang Su KIM

IPC: H01G4/005 ,  H01G4/12

Abstract: A capacitor component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in a first direction with the dielectric layer interposed therebetween; a first external electrode and a second external electrode disposed on the body, and respectively connected to the first internal electrode; and a third external electrode and a fourth external electrode disposed on the body, and respectively connected to the second internal electrode, wherein the first and second external electrodes include a connection metal layer, a ceramic layer, a metal layer, and a plated layer, respectively, sequentially disposed on the body, wherein the plated layer is extended and disposed to contact end surfaces of the connection metal layer, the ceramic layer, and the metal layer in the first direction, respectively.

公开(公告)号：US20170223833A1

公开(公告)日：2017-08-03

申请号：US15291745

申请日：2016-10-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyo Kwang LEE ,  Young Ghyu AHN ,  Jin KIM ,  Ho Jun LEE

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/224 ,  H05K1/11 ,  H01G4/005 ,  H01G4/248

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G4/012 ,  H01G4/224 ,  H01G4/232 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A chip electronic component includes a body, in which a distance from a first surface to a second surface opposing with respect to the first surface is equal to or less than a distance from a third surface to a fourth surface opposing with respect to the third surface, a first internal electrode, and a second internal electrode exposed to the second surface of the body, and spaced apart from the third surface and the fourth surface of the body by a predetermined distance. A first corner protection portion is disposed on portions of surfaces adjacent to a first corner, where the first corner is a corner formed by the first surface, the third surface and the fifth surface of the body.

公开(公告)号：US20150318113A1

公开(公告)日：2015-11-05

申请号：US14614207

申请日：2015-02-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Tae KIM ,  Kyoung Nam HWANG ,  Hwi Geun IM ,  Ho Jun LEE ,  Young Ghyu AHN ,  Woo Jin IN

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/12 ,  H01G4/248 ,  H01G4/012

CPC classification number: H01G2/065 ,  H01G4/005 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes: a ceramic body including a plurality of dielectric layers and a plurality of first and second internal electrodes stacked in a width direction; a pair of first external electrodes disposed on a mounting surface of the ceramic body to be spaced apart from one another and connected to the plurality of first internal electrodes; a second external electrode disposed between the pair of first external electrodes on the mounting surface of the ceramic body and connected to the plurality of second internal electrodes; and a dummy electrode disposed on a surface of the ceramic body opposing the mounting surface of the ceramic body.

Abstract translation: 一种多层陶瓷电容器包括：陶瓷体，其包括多个电介质层和沿宽度方向堆叠的多个第一和第二内部电极; 一对第一外部电极，设置在所述陶瓷体的安装表面上，以彼此间隔开并连接到所述多个第一内部电极; 第二外部电极，设置在陶瓷体的安装面上的一对第一外部电极之间，与多个第二内部电极连接; 以及设置在与陶瓷体的安装面相对的陶瓷体的表面上的虚拟电极。

公开(公告)号：US20230154678A1

公开(公告)日：2023-05-18

申请号：US17973038

申请日：2022-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Taek Jung LEE ,  Beom Seock OH ,  Ho Jun LEE ,  Kyung Mi BAE ,  Jin O YOO

IPC: H01G4/012 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/012 ,  H01G4/30 ,  H01G4/008 ,  H01G4/1227

Abstract: A multilayer ceramic capacitor includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; and a first external electrode and a second external electrode disposed externally on the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first and second external electrodes are disposed on the body, and includes a first electrode layer including Ni and Cr, a second electrode layer disposed on the first electrode layer, and including Cu, and a plating layer disposed on the second electrode layer.

公开(公告)号：US20180035545A1

公开(公告)日：2018-02-01

申请号：US15591619

申请日：2017-05-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyo Kwang LEE ,  Jin Kyung JOO ,  Chang Su KIM ,  Ho Jun LEE

IPC: H05K1/18 ,  H05K1/11 ,  H01G4/232 ,  H01G4/018 ,  H01G4/30 ,  H01G4/012

CPC classification number: H05K1/181 ,  H01G4/012 ,  H01G4/018 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K2201/10015

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with one of the dielectric layers interposed between each pair of adjacent first and second internal electrodes. First and second via electrodes penetrate through the plurality of second internal electrodes to thereby be exposed to a first surface of the capacitor body, and are disposed to be spaced apart from each other. First and second external electrodes are disposed on two side surfaces of the capacitor body and connected to opposing ends of the first internal electrodes, respectively. Third and fourth external electrodes are disposed on the first surface of the capacitor body to be spaced apart from each other, and are connected to end portions of the first and second via electrodes, respectively.