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    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20240387114A1

    公开(公告)日：2024-11-21

    申请号：US18588885

    申请日：2024-02-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chang Ho SEO ,  Jong Ho LEE ,  Yong Min HONG ,  Jung Tae PARK ,  Min Woo KIM ,  Yong PARK ,  Sun Mi KIM

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface, connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface, connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the third and fourth surfaces; and a first side margin portion and a second side margin portion, respectively disposed on the fifth and sixth surfaces, wherein the first and second side margin portions include a first extension portion disposed to extend onto a portion of the first surface and a portion of the second surface.

    MULTILAYER ELECTRONIC COMPONENT
    6.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20250029786A1

    公开(公告)日：2025-01-23

    申请号：US18615218

    申请日：2024-03-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong PARK ,  Jung Jin PARK ,  Kwan Soo PARK ,  Jong Ho LEE ,  Chang Ho SEO ,  Sun Mi KIM ,  Hyun Sik CHAE

    IPC: H01G4/18 ,  H01G4/12 ,  H01G4/30

    Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed alternately in a first direction with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in the third direction; a side margin portion disposed on the fifth and sixth surfaces; and an external electrode disposed on the third and fourth surfaces, wherein the side margin portion includes polydopamine, and wherein an average size of the plurality of dielectric grains included in the side margin portion is different from an average size of the plurality of dielectric grains included in the dielectric layer.

    METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
    9.
    发明公开
    METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240112864A1

    公开(公告)日：2024-04-04

    申请号：US18219854

    申请日：2023-07-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong PARK ,  Jung Tae PARK ,  Jong Ho LEE ,  Eun Jung LEE ,  Yong Min HONG ,  Jung Jin PARK ,  Rak Hyeon BAEK ,  Sun Mi KIM ,  Yong Ung LEE

    IPC: H01G4/30

    CPC classification number: H01G4/30

    Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.

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