公开(公告)号：US10804025B2

公开(公告)日：2020-10-13

申请号：US15822553

申请日：2017-11-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Hyuk Jang

IPC: H01F5/00 ,  H01F27/255 ,  H01F19/00 ,  H01F41/04 ,  H01F27/28 ,  H01F27/02 ,  H01F17/04 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

公开(公告)号：US11094458B2

公开(公告)日：2021-08-17

申请号：US15828091

申请日：2017-11-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kang Wook Bong ,  Byeong Cheol Moon ,  Boum Seock Kim ,  Jin Hyuk Jang ,  Joung Gul Ryu

IPC: H01F27/29 ,  H01F41/04 ,  H01F17/00 ,  H01F27/28 ,  H01F27/255 ,  H01F17/04

Abstract: A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.

公开(公告)号：US20230326666A1

公开(公告)日：2023-10-12

申请号：US18099751

申请日：2023-01-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Hyuk Jang

IPC: H01F27/02 ,  H01F27/24 ,  H01F27/29

CPC classification number: H01F27/292 ,  H01F27/022 ,  H01F27/24

Abstract: A coil component includes a body having one surface and the other surface opposing each other in one direction, a coil portion disposed in the body, the coil portion including a lead-out portion, and an external electrode disposed on the one surface of the body to be connected to the lead-out portion. An outermost surface of the external electrode is disposed of inwards than the one surface of the body.

公开(公告)号：US11551850B2

公开(公告)日：2023-01-10

申请号：US17030968

申请日：2020-09-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Hyuk Jang

IPC: H01F27/02 ,  H01F27/255 ,  H01F19/00 ,  H01F41/04 ,  H01F27/28 ,  H01F17/04 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F5/00

Abstract: A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

公开(公告)号：US10707009B2

公开(公告)日：2020-07-07

申请号：US15818468

申请日：2017-11-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Joung Gul Ryu ,  Byeong Cheol Moon ,  Jin Hyuk Jang

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/255 ,  H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/32

Abstract: A thin film-type inductor includes a body including a support member having a through-hole filled with a magnetic material and a via hole, a coil disposed on at least one side of the support member and including a plurality of coil patterns, and a magnetic material sealing the support member and the coil. Each of the coil patterns includes a first conductor layer, a second conductor layer, and a third conductor layer. The second conductor layer is disposed on a side surface of the via hole, and is disposed to seal a lower surface of the via hole.

公开(公告)号：US10015877B2

公开(公告)日：2018-07-03

申请号：US14849880

申请日：2015-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong Min ,  Myung Sam Kang ,  Jin Hyuk Jang ,  Young Gwan Ko

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538

CPC classification number: H05K1/0204 ,  H01L21/4882 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/0323

Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.