公开(公告)号：US11139114B2

公开(公告)日：2021-10-05

申请号：US16525732

申请日：2019-07-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Mo Ahn ,  Sang Roc Lee ,  Dong Hwi Shin

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer capacitor includes a body including a stack structure of a plurality of dielectric layers, and a plurality of internal electrodes stacked with the dielectric layers interposed therebetween. A stress alleviation portion is disposed on at least one surface among surfaces of the body, and an external electrode is disposed on an external portion of the body and connected to the internal electrodes. The stress alleviation portion includes a first resin layer adjacent to the body, and a second resin layer covering the first resin layer and including a filler dispersed in a resin of the second resin layer.

公开(公告)号：US12217914B2

公开(公告)日：2025-02-04

申请号：US17725162

申请日：2022-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Hyun Park ,  Jin Mo Ahn ,  Ji Hong Jo

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12

Abstract: A ceramic electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in the first direction and side surfaces connected to the first and second surfaces, an external electrode disposed on one of the side surfaces of the body extending onto a portion of the first surface of the body, and an insulating layer covering a surface of the external electrode and including a plurality of openings exposing the external electrode, wherein a ratio of an area of the plurality of openings to an area of the surface of the external electrode covered by the insulating layer is 20% to 70%.

公开(公告)号：US10902990B2

公开(公告)日：2021-01-26

申请号：US15818130

申请日：2017-11-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Suk Oh ,  Jin Mo Ahn

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/10 ,  H01F27/255 ,  H01F41/04 ,  H01F27/32 ,  H01F17/04

Abstract: A coil component includes a body having a winding coil and a plurality of guide members therein. The guide members are spaced apart from each other along an outer periphery of the winding coil, and each of the guide members has an exposed surface exposed externally of the body. A method for manufacturing a coil component includes seating opposing ends of a winding coil on a support member of a frame having guide members restricting movement of the winding coil relative to the frame. A body is formed that embeds the winding coil and at least a portion of each of the guide members therein, and the guide members restrict movement of the winding coil during the forming of the body.

公开(公告)号：US10170246B2

公开(公告)日：2019-01-01

申请号：US15641990

申请日：2017-07-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Mo Ahn ,  Sun Cheol Lee

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/232

Abstract: A capacitor component includes a body including a plurality of dielectric layers having a stacked structure, and first and second internal electrodes which are alternately disposed while having the dielectric layer interposed therebetween; and first and second external electrodes formed on an outer surface of the body, and connected to the first and second internal electrodes, respectively, wherein the body includes an active region having capacity by the first and second internal electrodes and a cover region located above and below the active region, the cover region includes a protection pattern of a metal material connected to the first external electrode or the second external electrode, and the protection pattern does not overlap with the internal electrode having a different polarity among the first and second internal electrodes in a thickness direction of the body.

公开(公告)号：US10049808B2

公开(公告)日：2018-08-14

申请号：US14926953

申请日：2015-10-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Mo Ahn ,  Yun Suk Oh ,  Jae Yeol Choi

IPC: H01F27/30 ,  H01F27/28 ,  H01F17/04 ,  H01F27/29

Abstract: A coil component assembly includes a support member, a plurality of processed spaces penetrating through the support member, a plurality of coils disposed in the plurality of processed spaces, respectively, and a magnetic material covering the support member and the plurality of coils. The coil component assembly can be diced to form individually coil components.

公开(公告)号：US12136518B2

公开(公告)日：2024-11-05

申请号：US17981851

申请日：2022-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Young Jeong ,  Jin Mo Ahn ,  Ji Hong Jo

IPC: H01G4/224 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.

公开(公告)号：US11742145B2

公开(公告)日：2023-08-29

申请号：US17468242

申请日：2021-09-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Mo Kang ,  Jin Mo Ahn ,  Ga Young An

IPC: H01G4/30 ,  H01G4/008 ,  H01G2/06 ,  H01G4/12 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode including a connection portion disposed on one of the third and fourth surfaces, an upper band portion extending from the connection portion onto a portion of the second surface, and a lower band portion extending onto a portion of the first surface. The external electrode includes a Pd plating layer disposed on an external surface of the lower band portion, and the Pd plating layer is disposed to extend onto a portion of the connection portion.

公开(公告)号：US11735367B2

公开(公告)日：2023-08-22

申请号：US17470242

申请日：2021-09-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Young Jeong ,  Jin Mo Ahn ,  Eun Hee Jeong ,  Ga Young An

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012

Abstract: A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode.

公开(公告)号：US20220208467A1

公开(公告)日：2022-06-30

申请号：US17470242

申请日：2021-09-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Young Jeong ,  Jin Mo Ahn ,  Eun Hee Jeong ,  Ga Young An

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008

Abstract: A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode.

公开(公告)号：US10734161B2

公开(公告)日：2020-08-04

申请号：US15995637

申请日：2018-06-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Beom Joon Cho ,  Ki Young Kim ,  Jae Young Na ,  Jin Mo Ahn

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H05K3/34 ,  H01G4/12 ,  H01G4/38 ,  H01G2/06 ,  H05K1/18

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.