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公开(公告)号：US10305446B2
公开(公告)日：2019-05-28
申请号：US15179248
申请日：2016-06-10
发明人： Jae Sang Lee , Ho Phil Jung , Sung Wook Kim , Tae Joon Park , In Young Kang , Dong Joon Oh , Je Hong Kyoung , Kyo Yeol Lee , Jong Pil Lee , Seung Mo Lim
摘要： A piezoelectric oscillator, and method of making the same, includes an oscillation substrate comprising an oscillating part and a surrounding part, wherein the surrounding part is thinner than the oscillating part, and oscillating electrodes disposed on an upper surface and a lower surface of the oscillating part. The oscillation substrate is configured according to H=400.59×S+1.75±1.5, wherein H=100×(T2/T1) and S=T2/(L1−L2), wherein L1 represents an entire length of the oscillation substrate, L2 represents a length of the oscillating part, T1 represents a thickness of the oscillating part, and T2 represents a step height between the oscillating part and the surrounding part.
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公开(公告)号：US11264166B2
公开(公告)日：2022-03-01
申请号：US16593692
申请日：2019-10-04
发明人： Su Rim Bae , Jong Pil Lee , Hae In Kim , Eun Ju Oh
摘要： An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.
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公开(公告)号：US10861625B2
公开(公告)日：2020-12-08
申请号：US16299721
申请日：2019-03-12
发明人： Jong Pil Lee , Ichiro Tanaka , Doo Ho Yoo , Hyun Jun Choi , Hyung Gon Kim , Hyung Seok Roh , Jung Il Kim
摘要： An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
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公开(公告)号：US20180144848A1
公开(公告)日：2018-05-24
申请号：US15680663
申请日：2017-08-18
发明人： Jong Pil Lee , Seung Woo Song , Ji Hyun Park , Jong Bong Lim
CPC分类号： H01C1/14 , H01C1/01 , H01C1/148 , H01C7/003 , H01C17/006 , H01C17/06 , H01C17/281
摘要： A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.
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5.发明授权公开(公告)号：US10516382B2
公开(公告)日：2019-12-24
申请号：US14854588
申请日：2015-09-15
发明人： Jong Pil Lee , Seung Mo Lim
摘要： There is provided a piezoelectric vibration member including: a vibration substrate including a vibrating portion and a surrounding portion which is thinner than the vibrating portion; and vibrating electrodes disposed on one surface and the other surface of the vibrating portion in a thickness direction, wherein the vibrating portion includes protrusion portions protruding in relation to one surface and the other surface of the surrounding portion in the thickness direction, and at least one side surface of the protrusion portion has two or more crystal planes.
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公开(公告)号：US10355074B2
公开(公告)日：2019-07-16
申请号：US15890838
申请日：2018-02-07
发明人： Jong Pil Lee , Jong Bong Lim , Hai Joon Lee , Ji Hyun Park
IPC分类号： H01L23/522 , H01L49/02 , H01L23/528
摘要： A monolayer thin film capacitor includes: a bottom electrode; a top electrode; a dielectric layer disposed between the bottom electrode and the top electrode; a first via formed in the dielectric layer so as to penetrate through the dielectric layer; a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via; and a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.
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公开(公告)号：US10200011B2
公开(公告)日：2019-02-05
申请号：US15153158
申请日：2016-05-12
发明人： Dong Woo Lee , Sung Wook Kim , Seung Mo Lim , Jong Pil Lee
IPC分类号： H01L41/09 , H01L41/047 , H03H9/10
摘要： A crystal oscillator package includes a crystal piece configured to vibrate in response to an electrical signal, a first vibrating part protruding from an upper surface of the crystal piece, a second vibrating part protruding from a lower surface of the crystal piece, a first exciting electrode disposed on the first vibrating part, a second exciting electrode disposed on the second vibrating part, and protrusions extending from an end portion of the lower surface of the crystal piece. The protrusions include two or more stages.
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公开(公告)号：US10734141B2
公开(公告)日：2020-08-04
申请号：US16298394
申请日：2019-03-11
发明人： Jong Pil Lee , Doo Ho Yoo , Hyung Gon Kim , Jung Il Kim , Hyun Jun Choi , Hyung Seok Roh
摘要： An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
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公开(公告)号：US10559425B2
公开(公告)日：2020-02-11
申请号：US16270745
申请日：2019-02-08
发明人： Jong Pil Lee , Hyo Youn Lee , Sung Kwon An , Seung Woo Song , Taek Jung Lee , Jin Kyung Joo
IPC分类号： H01G4/012 , H01G4/232 , H01G4/248 , H01G4/30 , H01K1/18 , H05K1/18 , H01G2/06 , H01G4/12 , H05K1/11
摘要： A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
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公开(公告)号：US20140355647A1
公开(公告)日：2014-12-04
申请号：US14294910
申请日：2014-06-03
发明人： Soon Bum Lee , Sang Yeob Cha , Jong Pil Lee , Katsushi Yasuda
CPC分类号： H01L41/25 , G01K1/14 , H01L41/08 , H01L41/22 , H03B5/36 , H03H9/02102 , H03H9/08 , H03H9/1021 , H03L1/00 , Y10T29/42
摘要： A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case.
摘要翻译： 压电器件封装可以包括：形成在其下表面上的多个端子的壳体; 形成在该壳体中的压电装置; 温度测量装置，形成在壳体的下表面上并具有薄膜形式; 以及封闭壳体的上部的盖构件。
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