-
公开(公告)号：US10305018B2
公开(公告)日：2019-05-28
申请号：US15291794
申请日：2016-10-12
发明人： Jeong Ryeol Kim , Bum Suk Kang , Hyo Min Kang , Hang Kyu Cho , Chang Hoon Kim
IPC分类号： H01G4/12 , H01L41/047 , H01C7/00 , H01C7/10 , H01C17/28 , H01F27/28 , H01F27/29 , H01F37/00 , H01F41/10 , H01G4/008 , H01G4/30 , H01L41/273 , H01C1/148 , H01C7/18 , H01G4/232 , H01L41/293 , H01F17/00
摘要： A manufacturing method of an electronic component includes forming a body including first and second internal electrodes respectively exposed from first and second end surfaces of the body and dielectric layers disposed between the first and second internal electrodes; applying, on the first and second end surfaces of the body, a paste containing a metal powder and first glass; and sintering the body and the paste to convert the paste to first and second external electrodes including crystalline metal particles having a polyhedral shape and second glass and respectively connected to the first internal electrodes and the second internal electrodes
-
2.发明授权公开(公告)号：US12106905B2
公开(公告)日：2024-10-01
申请号：US17707390
申请日：2022-03-29
发明人： Bum Suk Kang , Su Jin Lee , Dae Woo Yoon , Da Mi Kim , Jeong Ryeol Kim
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
摘要： A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.
-
公开(公告)号：US20240194403A1
公开(公告)日：2024-06-13
申请号：US18386090
申请日：2023-11-01
发明人： Bum Suk Kang , Dae Woo Yoon , Da Mi Kim , Su Jin Lee
摘要： A protective layer including glass may be disposed between an end of a first electrode layer in contact with one end of an internal electrode and a body thereby blocking a penetration path of external moisture, a plating solution, and hydrogen to improve the moisture resistance reliability of a multilayer electronic component.
-
公开(公告)号：US11990279B2
公开(公告)日：2024-05-21
申请号：US17702223
申请日：2022-03-23
发明人： Dae Woo Yoon , Su Jin Lee , Da Mi Kim , Bum Suk Kang , Seong Han Park , Jeong Ryeol Kim
CPC分类号： H01G4/008 , C03C3/066 , C03C3/093 , C03C4/14 , C03C8/04 , C03C8/18 , H01G4/248 , C03C2204/00 , H01G4/30
摘要： A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.
-
公开(公告)号：US11031185B2
公开(公告)日：2021-06-08
申请号：US15975131
申请日：2018-05-09
发明人： Jeong Ryeol Kim , Bum Suk Kang , Hyo Min Kang , Hang Kyu Cho , Chang Hoon Kim
IPC分类号： H01G4/232 , H01C1/148 , H01C7/18 , H01C17/28 , H01L41/047 , H01L41/293 , H01C7/00 , H01G4/30 , H01L41/273 , H01C7/10 , H01F17/00 , H01F27/29 , H01G4/12 , H01F27/28 , H01F37/00 , H01F41/10 , H01G4/008
摘要： An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.
-
6.发明授权Conductive paste for external electrodes and multilayer ceramic electronic component using the same 有权用于外部电极的导电浆料和使用其的多层陶瓷电子部件公开(公告)号：US09251925B2
公开(公告)日：2016-02-02
申请号：US13935229
申请日：2013-07-03
发明人： Bum Suk Kang , Hew Young Kim , Jeong Ryeol Kim , Chang Hoon Kim , Dong Hoon Kim , Doo Young Kim
CPC分类号： H01B1/22 , H01G4/2325 , H01G4/30
摘要： There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20≦a≦60, 10≦b≦40, and 2≦c≦25 are satisfied.
摘要翻译： 提供外部电极用导电性糊剂和使用其的多层陶瓷电子部件。 导电糊包括导电金属粉末，其包括导电金属颗粒; 和包含具有（Si，B）-b（Li，K）-c（V，Mn）的非晶态金属颗粒的导电非晶金属粉末，其中+ b + c = 100,20和nlE; a＆nlE; 60,10和nlE; b ; 40和2＆nlE; c＆nlE; 25。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.015 秒)
