公开(公告)号：US20230127398A1

公开(公告)日：2023-04-27

申请号：US17706010

申请日：2022-03-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyu Ho LEE ,  Woon Kyung LEE

IPC: H01G4/01

Abstract: A capacitor component includes: a plurality of conductive nanowires disposed to be spaced apart from each other; first and second connecting conductive layers respectively disposed on one end and the other end of the plurality of conductive nanowires, and connected to the plurality of conductive nanowires; a conductive body surrounding the plurality of conductive nanowires; and a dielectric film disposed between the plurality of conductive nanowires, each of the first and second connecting conductive layers, and the conductive body.

公开(公告)号：US20160141090A1

公开(公告)日：2016-05-19

申请号：US14924213

申请日：2015-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Hyun PARK ,  Ki Hyun PARK ,  Kyu Ho LEE

IPC: H01F27/255 ,  H01F41/04 ,  H01F41/02 ,  H01F27/245 ,  H01F27/28

CPC classification number: H01F17/04 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/0233 ,  H01F2017/048

Abstract: An electronic component includes a magnetic body containing internal coil parts, wherein the magnetic body includes a magnetic metal powder; a thermosetting resin; and a color coupler.

Abstract translation: 电子部件包括含有内部线圈部的磁性体，其中磁性体包括磁性金属粉末; 热固性树脂; 和彩色耦合器。

公开(公告)号：US20230064255A1

公开(公告)日：2023-03-02

申请号：US17702236

申请日：2022-03-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyu Ho LEE ,  Woon Kyung LEE

IPC: H01B7/00 ,  H01B1/02 ,  H01B3/08 ,  H01B13/00

Abstract: The present disclosure provides a nanowire bundle including a plurality of cores including metal and arranged in a predetermined shape at regular intervals; a first glass portion including glass and covering the plurality of cores; and a second glass portion including glass and covering the first glass portion, and a method for manufacturing the nanowire bundle.

公开(公告)号：US20140083755A1

公开(公告)日：2014-03-27

申请号：US13713747

申请日：2012-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sun Cheol LEE ,  Woo Sup KIM ,  Dong Gun KIM ,  Kyeong Jun KIM ,  Kyu Ho LEE

IPC: H05K1/18 ,  H05K1/03 ,  H01C7/00 ,  H01L41/083 ,  H01G4/12 ,  H01C7/10

CPC classification number: H05K1/181 ,  H01C7/008 ,  H01C7/10 ,  H01G2/06 ,  H01G2/24 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H01L41/083 ,  H05K1/0306 ,  Y02P70/611

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Abstract translation: 层叠芯片电子部件包括：陶瓷体，其包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入电介质层的有源层以形成电容; 以及在有源层的厚度方向的上部和下部形成的上部和下部覆盖层，所述下部覆盖层的厚度大于上部覆盖层的厚度。