利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

15 条记录 (耗时 0.018 秒)

    CHIP COMPONENT
    1.
    发明申请
    CHIP COMPONENT 有权
    芯片组件

    公开(公告)号：US20160111216A1

    公开(公告)日：2016-04-21

    申请号：US14677639

    申请日：2015-04-02

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Sun Cheol LEE ,  Seung Yul LEE ,  Bok Goo HEO ,  Kyung Pyo HONG ,  Min Hyang KIM ,  Kyoung Hoon KIM ,  Hyoung Wook LIM ,  Sang Hyun PARK ,  Mi Ok PARK

    IPC分类号： H01G4/30 ,  H01G4/12 ,  H01G4/224

    CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232

    摘要： A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.

    摘要翻译： 芯片部件包括：陶瓷体，包括电容形成部，其中第一和第二电介质层交替设置; 以及设置在陶瓷体的两端面的外部电极，其中电容形成部分包括在第一电介质层上彼此间隔开并暴露于陶瓷体的端面的第一和第二内部电极，从而与陶瓷体的端面连接 外部电极; 以及布置在所述第二电介质层上且与所述第一和第二内部电极的部分重叠的浮动电极，所述陶瓷体包括设置在所述第一和第二内部电极的上表面和下表面之间的保护部分和所述电容形成部分，并且具有第三电介质层， 布置暴露于陶瓷体的端面的电极，保护部分包括设置在第一和第二虚拟电极之间的第三虚拟电极。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND BOARD HAVING THE SAME MOUNTED THEREON
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电子元件及其制造方法以及与其相同的板

    公开(公告)号：US20150187500A1

    公开(公告)日：2015-07-02

    申请号：US14332003

    申请日：2014-07-15

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Sim Chung KANG ,  Seung Hee YOO ,  Kyung Pyo HONG

    IPC分类号： H01G4/30 ,  H01G4/12 ,  B05D7/00 ,  H05K1/18 ,  B05D1/36 ,  B05D5/00 ,  H01G4/012 ,  H05K1/09

    CPC分类号： H01G4/30 ,  H01G2/065 ,  H01G4/12 ,  H01G4/2325 ,  H05K1/181 ,  H05K2201/10015

    摘要： A multilayer ceramic electronic component may include a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor containing carbon nanotubes, and a base resin. When the multilayer ceramic electronic component is heat-tested by raising a temperature of the multilayer ceramic electronic component from room temperature to about 900° C. at a rate of about 10° C./min, a weight of the multilayer ceramic electronic component decreases by about 0.33% to about 2.19%.

    摘要翻译： 多层陶瓷电子部件可以包括包括电介质层和内部电极的陶瓷体，与内部电极连接的电极层，以及形成在电极层上的导电性树脂层，并且包括第一导体，含有碳纳米管的第二导体和 基础树脂。 当通过将多层陶瓷电子部件的温度以约10℃/分钟的速率从室温升高至约900℃来对多层陶瓷电子部件进行热测试时，多层陶瓷电子部件的重量减少 约0.33％至约2.19％。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    5.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装板

    公开(公告)号：US20150096795A1

    公开(公告)日：2015-04-09

    申请号：US14255397

    申请日：2014-04-17

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Kyung Pyo HONG ,  Doo Young KIM ,  Chang Hoon KIM ,  Sang Hyun PARK ,  Hae Sock CHUNG

    IPC分类号： H01G4/005 ,  H01G2/06 ,  H01G4/30

    CPC分类号： H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

    摘要： A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; and first and second external electrodes formed to end surfaces of the ceramic body. The ceramic body may includes an active layer, a capacitance formation portion, and a cover layer, a non-capacitance formation portion, the cover layer includes a plurality of dummy electrode layers. When the number of the first and second internal electrodes is defined as AL, a thickness of each of the first and second internal electrodes is defined as AT, a thickness of each of the dummy electrode layers is defined as DT, and the number of the dummy electrode layers is defined as DL, DL is equal to {(T×x)−(AL×AT)}/DT, x being 9.0% or more.

    摘要翻译： 多层陶瓷电容器可以包括：包括电介质层的陶瓷体; 布置在陶瓷体中的第一和第二内部电极; 以及形成在陶瓷体的端面的第一外部电极和第二外部电极。 陶瓷体可以包括有源层，电容形成部分和覆盖层，非电容形成部分，覆盖层包括多个虚拟电极层。 当第一和第二内部电极的数量被定义为AL时，第一和第二内部电极的厚度被定义为AT，每个虚拟电极层的厚度被定义为DT，并且 虚拟电极层被定义为DL，DL等于{（T×x） - （AL×AT）} / DT，x为9.0％以上。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20140233147A1

    公开(公告)日：2014-08-21

    申请号：US13871767

    申请日：2013-04-26

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Kyung Pyo HONG ,  Byung Jun JEON ,  Byoung Jin CHUN ,  Jae Hwan HAN

    IPC分类号： H01G4/008 ,  H01G4/12

    CPC分类号： H01G4/008 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

    摘要： There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：包含电介质层的陶瓷体; 堆叠在陶瓷体内的多个内部电极，以及形成在陶瓷体的外表面上并与内部电极电连接的外部电极，其中外部电极包括形成在金属层上的金属层和导电树脂层， 含有铜粉末和环氧树脂的导电树脂层，所述铜粉末包含含量为10重量％以上且粒径为2μm以上的第一铜粉末和含有5重量％以上的第二铜粉末的铜粉末， 以上且0.7μm以下的粒径，第一铜粉末为球状粉末粒子和片状粉末粒子的混合物。

    MULTI-LAYER CERAMIC CAPACITOR
    7.
    发明申请
    MULTI-LAYER CERAMIC CAPACITOR 审中-公开
    多层陶瓷电容器

    公开(公告)号：US20160042865A1

    公开(公告)日：2016-02-11

    申请号：US14817804

    申请日：2015-08-04

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Kyung Pyo HONG ,  Yo Han SEO ,  Sang Hyun PARK ,  Young Bae KIL

    IPC分类号： H01G4/12 ,  H01G4/248 ,  H01G4/012 ,  H01G4/30

    CPC分类号： H01G4/12 ,  H01G4/012 ,  H01G4/30

    摘要： The present invention relates to a multi-layer ceramic capacitor which includes a ceramic body on which an inner electrode and a dielectric layer are alternately stacked, a crack prevent layer formed on both sides of the ceramic body and an external electrode covering both ends of the ceramic body on which the crack prevention layer is formed.

    摘要翻译： 本发明涉及一种多层陶瓷电容器，其包括内部电极和电介质层交替堆叠的陶瓷体，形成在陶瓷体两侧的防裂层和覆盖陶瓷体的两端的外部电极 形成有防裂层的陶瓷体。

    MULTILAYER CERAMIC CAPACITOR, MOUNTING BOARD THEREFOR, AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    MULTILAYER CERAMIC CAPACITOR, MOUNTING BOARD THEREFOR, AND MANUFACTURING METHOD THEREOF 审中-公开
    多层陶瓷电容器及其制造方法及其制造方法

    公开(公告)号：US20140196936A1

    公开(公告)日：2014-07-17

    申请号：US13844293

    申请日：2013-03-15

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Kyung Pyo HONG ,  Hyun Hee GU ,  Doo Young KIM ,  Young Ghyu AHN ,  Chang Hoon KIM

    IPC分类号： H05K1/02 ,  H05K7/14

    CPC分类号： H05K7/1422 ,  H01G2/065 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045

    摘要： There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the plurality of dielectric layers and alternately exposed to both end surfaces of the ceramic body; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the respective first and second internal electrodes; and first and second non-conductive epoxy resin layers formed on peripheral surfaces of the first and second external electrodes except for mounting surfaces of the first and second external electrodes.

    摘要翻译： 提供了一种多层陶瓷电容器，其包括：多个电介质层堆叠的陶瓷体; 多个第一和第二内部电极，形成在所述多个电介质层的至少一个表面上并且交替地暴露于所述陶瓷体的两个端面; 第一和第二外部电极，其形成在陶瓷体的两个端面上并电连接到相应的第一和第二内部电极; 以及形成在第一外部电极和第二外部电极的外周表面上的第一和第二非导电环氧树脂层，除了第一和第二外部电极的安装表面之外。