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公开(公告)号：US20230215648A1
公开(公告)日：2023-07-06
申请号：US17706785
申请日：2022-03-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su BYUN , Se Hun PARK , Soo Hwan SON , Taek Jung LEE
CPC classification number: H01G4/30 , H01G2/065 , H01G4/012 , H01G4/1218 , H05K1/111 , H05K2201/10015
Abstract: A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein AV indicates a total area of the at least one hole, AB indicates an area of the one surface of the first or second bump, facing the first or second external electrode, and AV/AB is greater than 0.012 and less than 0.189.
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公开(公告)号：US20190069410A1
公开(公告)日：2019-02-28
申请号：US15959993
申请日：2018-04-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su BYUN , Ho Yoon KIM , Kyung Hwa YU , Dae Heon JEONG , Min Kyoung CHEON , Soo Hwan SON
Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.
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公开(公告)号：US20220181084A1
公开(公告)日：2022-06-09
申请号：US17533582
申请日：2021-11-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su BYUN , Ho Yoon KIM , Min Kyoung CHEON , Soo Hwan SON , Won Chul SIM
Abstract: The present disclosure provides a multilayer capacitor and a board component having the same. The multilayer capacitor includes: a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first to sixth surfaces; first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively; an insulator disposed on the first surface of the capacitor body; a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction.
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公开(公告)号：US20170346279A1
公开(公告)日：2017-11-30
申请号：US15381532
申请日：2016-12-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Soo Hwan SON , Ho Yoon KIM , Man Su BYUN
Abstract: A complex electronic component includes a body including a first external electrode and a second external electrode, disposed on an external surface thereof and a laminate; a plurality of first electrodes and a plurality of second electrodes, disposed in the laminate and electrically connected to the first external electrode and the second external electrode, respectively; a third electrode and a fourth electrode, disposed on the laminate to be spaced apart from each other and electrically connected to the first external electrode and the second external electrode, respectively; and an ESD discharge layer disposed between the third electrode and the fourth electrode. In addition, a distance between the third electrode and the fourth electrode is within a range of 30 μm to 60 μm.
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公开(公告)号：US20200092999A1
公开(公告)日：2020-03-19
申请号：US16691787
申请日：2019-11-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su BYUN , Ho Yoon KIM , Kyung Hwa YU , Dae Heon JEONG , Min Kyoung CHEON , Soo Hwan SON
Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.
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Patent Agency Ranking
公开(公告)号：US20190180945A1
公开(公告)日：2019-06-13
申请号：US15974285
申请日：2018-05-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon KIM , Kyung Hwa YU , Man Su BYUN , Dae Heon JEONG , Min Kyoung CHEON , Soo Hwan SON
CPC classification number: H01G4/40 , H01G4/012 , H01G4/1227 , H01G4/224 , H01G4/232 , H01G4/248 , H01G4/30 , H02H9/02 , H05K1/181 , H05K2201/10015 , H05K2201/2045
Abstract: A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.
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公开(公告)号：US20190069412A1
公开(公告)日：2019-02-28
申请号：US16001510
申请日：2018-06-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon KIM , Kyung Hwa YU , Man Su BYUN , Dae Heon JEONG , Min Kyoung CHEON , Soo Hwan SON
Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05≤A1/A1≤0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.
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公开(公告)号：US20190066918A1
公开(公告)日：2019-02-28
申请号：US15994871
申请日：2018-05-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Heon JEONG , Young Ghyu AHN , Ho Yoon KIM , Man Su BYUN , Soo Hwan SON
Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.
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公开(公告)号：US20200253057A1
公开(公告)日：2020-08-06
申请号：US16856444
申请日：2020-04-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su BYUN , Ho Yoon KIM , Kyung Hwa YU , Dae Heon JEONG , Min Kyoung CHEON , Soo Hwan SON
Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.
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公开(公告)号：US20190157005A1
公开(公告)日：2019-05-23
申请号：US15995899
申请日：2018-06-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Soo Hwan SON , Young Ghyu AHN , Man Su BYUN
Abstract: A composite electronic component includes a composite body including: a multilayer ceramic capacitor including a first ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween and stacked to be perpendicular to a lower surface of the first ceramic body, and a ceramic chip being coupled to the multilayer ceramic capacitor and disposed on a lower portion of the multilayer ceramic capacitor, the ceramic chip including a second ceramic body, first and second terminal electrodes disposed on upper and lower portions of the second ceramic body and connected to the first and second external electrodes, respectively.
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