公开(公告)号：US09865399B2

公开(公告)日：2018-01-09

申请号：US14876774

申请日：2015-10-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hun Cho ,  Chang Ho Lee ,  Won Sik Chong

IPC: H01G4/38 ,  H01G4/012 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12

CPC classification number: H01G4/385 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

公开(公告)号：US09390844B2

公开(公告)日：2016-07-12

申请号：US14221822

申请日：2014-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hun Cho ,  Young Key Joo Kim ,  Chang Ho Lee ,  Byung Sung Kang

IPC: H01C1/012 ,  H01C7/00 ,  H01C7/18 ,  H01C17/00 ,  H01C17/065

CPC classification number: H01C7/003 ,  H01C7/18 ,  H01C17/006 ,  H01C17/06526 ,  H01C17/06533

Abstract: A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.

Abstract translation: 芯片电阻器可以包括：具有堆叠在其中的多个基板的主体; 多个电阻器，其形成在主体中，各自的基板插入其间并通过主体的两个端面露出; 以及分别覆盖主体的两个端面的第一和第二电极，并且分别连接到暴露的电阻器的两个端部。