公开(公告)号：US20140102767A1

公开(公告)日：2014-04-17

申请号：US13845092

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myung Sam Kang ,  Ki Hwan Kim ,  Yong Yoon Cho ,  Sung Won Jeong ,  Sang Hyuck Oh ,  Da Hee Kim ,  Yoong Oh ,  Ki Young Yoo

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/146 ,  H05K3/243 ,  H05K3/26 ,  H05K3/4647 ,  H05K3/4661 ,  H05K3/467 ,  H05K3/4682 ,  H05K2201/096 ,  H05K2203/0591 ,  H05K2203/1338 ,  H05K2203/1461

Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.

Abstract translation: 本文公开了一种多层型印刷电路板，包括： 包括至少一个第一柱的第一绝缘层; 在所述第一绝缘层的两个表面方向上层叠的多个绝缘层，每个绝缘层包括至少一个电路层和至少另一个连接到所述电路层的柱; 以及多个最外层电路层，其设置在最外绝缘层的外表面上，同时接触设置在多个绝缘层中的最外绝缘层上的最外层柱，其中电路层和另一柱形成在两个表面方向上 所述第一绝缘层基于所述第一绝缘层以彼此对称的形式设置。

公开(公告)号：US20150129291A1

公开(公告)日：2015-05-14

申请号：US14540028

申请日：2014-11-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Won JEONG ,  Yong Yoon Cho ,  Jung Hyun Park ,  Ki Hwan Kim ,  Da Hee Kim ,  Gi Ho Han

IPC: H05K1/02 ,  C23F1/02 ,  H05K3/38 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/184 ,  H05K3/244 ,  H05K3/384 ,  H05K2203/095

Abstract: Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other or a diameter of the lower portion is larger than that of the upper portion. Therefore, the printed circuit board according to a preferred embodiment of the present invention forms the circuit pattern having the lower portion having the diameter larger than that of the upper portion, such that the electrical signal loss may be decreased and separation of the circuit pattern may be prevented, thereby improving whole reliability of the board.

Abstract translation: 本文公开了一种印刷电路板，包括：基板; 形成在所述基板上的种子层; 以及形成在种子层上并且形成为使得其上部的直径和其下部的宽度彼此相等或下部的直径大于上部的直径的电路图案。 因此，根据本发明的优选实施例的印刷电路板形成具有比上部的直径更大的直径的下部的电路图案，使得电信号损失可能减小，并且电路图案的分离 从而提高板的整体可靠性。