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1.发明申请公开(公告)号：US20140102767A1
公开(公告)日：2014-04-17
申请号：US13845092
申请日：2013-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam Kang , Ki Hwan Kim , Yong Yoon Cho , Sung Won Jeong , Sang Hyuck Oh , Da Hee Kim , Yoong Oh , Ki Young Yoo
CPC classification number: H05K1/0298 , H05K3/0064 , H05K3/007 , H05K3/0097 , H05K3/146 , H05K3/243 , H05K3/26 , H05K3/4647 , H05K3/4661 , H05K3/467 , H05K3/4682 , H05K2201/096 , H05K2203/0591 , H05K2203/1338 , H05K2203/1461
Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.
Abstract translation: 本文公开了一种多层型印刷电路板，包括： 包括至少一个第一柱的第一绝缘层; 在所述第一绝缘层的两个表面方向上层叠的多个绝缘层，每个绝缘层包括至少一个电路层和至少另一个连接到所述电路层的柱; 以及多个最外层电路层，其设置在最外绝缘层的外表面上，同时接触设置在多个绝缘层中的最外绝缘层上的最外层柱，其中电路层和另一柱形成在两个表面方向上 所述第一绝缘层基于所述第一绝缘层以彼此对称的形式设置。
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公开(公告)号：US20150075845A1
公开(公告)日：2015-03-19
申请号：US14485534
申请日：2014-09-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Young Yoo
CPC classification number: H05K3/4644 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/172 , H05K1/115 , H05K3/4647 , H05K2203/025
Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; and an outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section.
Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例，印刷电路板包括：基底; 形成在所述基底基板上并具有第一内层电路层，第二内层电路层，所述内层绝缘层以及具有锥形部的内层的内层积层。 以及形成在内层积层上的外层积层，其包括外层电路层，外层绝缘层和经由矩形截面的外层。
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公开(公告)号：US20240029945A1
公开(公告)日：2024-01-25
申请号：US18093961
申请日：2023-01-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hwan Yang , Jae Hun Kim , Doo Ho Park , Hye Hun Park , In Young Kang , Ki Young Yoo , Boum Seock Kim
IPC: H01F27/32 , H01F17/00 , C09D125/18 , C09D133/08 , C09D133/10
CPC classification number: H01F27/324 , H01F17/0013 , C09D125/18 , C09D133/08 , C09D133/10 , H01F2017/002
Abstract: A coil component includes: a body; a coil disposed within the body; and an insulating film covering at least a portion of the coil in the body, wherein the insulating film includes a copolymer including a repeating unit derived from a monomer containing an unsaturated bond and a repeating unit derived from a parylene monomer.
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Patent Agency Ranking
公开(公告)号：US20140027156A1
公开(公告)日：2014-01-30
申请号：US13664091
申请日：2012-10-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
Inventor： Ki Hwan Kim , Myung Sam Kang , Keung Jin Sohn , Yoong Oh , Da Hee Kim , Ki Young Yoo , Han Ui Lee , Sang Hyuck Oh
CPC classification number: H05K3/4682 , H05K3/0097 , H05K3/4647 , H05K2203/0152 , H05K2203/1536 , Y10T29/49155 , Y10T29/49156
Abstract: Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars.
Abstract translation: 本发明公开了一种制造多层型无芯基板的方法，该方法包括：（A）制备载体基板，其包括在绝缘表面的一个表面或两个表面上形成的至少一个铜箔; （B）在载体基板的一个表面或两个表面上形成无芯无印刷电路前体; （C）分离载体基板; （D）对无芯印刷电路前体进行抛光切割处理; 以及（E）在所述无芯印刷电路前体的平坦外表面上层叠多个其它绝缘层，所述多个其它绝缘层依次包括其它电路层和其他柱。
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公开(公告)号：US20240212918A1
公开(公告)日：2024-06-27
申请号：US18377630
申请日：2023-10-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Young Kim , Ki Young Yoo , Boum Seock Kim
CPC classification number: H01F27/2828 , H01F27/292
Abstract: A coil component includes: a body; a coil buried in the body; an external electrode disposed on one surface of the body; and a lead-out portion connecting an end of the coil to the external electrode, wherein the lead-out portion and the end of the coil form an interface.
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公开(公告)号：US11107621B2
公开(公告)日：2021-08-31
申请号：US16032689
申请日：2018-07-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Hyuk Jung , Ki Young Yoo , Dong Min Kim , Hye Yeon Cha
Abstract: A coil component includes a body including a magnetic material; a support member disposed in the body; and a coil pattern on the support member in the body. The coil pattern may include a first conductor layer formed on the support member and having a planar spiral shape; a second conductor layer formed on the first conductor layer and having a volume of a lower portion greater than a volume of an upper portion; and a third conductor layer formed to cover the second conductor layer from the outside of the second conductor layer.
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公开(公告)号：US11056274B2
公开(公告)日：2021-07-06
申请号：US16050808
申请日：2018-07-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Hyuk Jung , Ki Young Yoo , Hye Yeon Cha , Ji Hye Oh
Abstract: A thin film type inductor includes a body and external electrodes disposed on an external surface of the body. The body includes a support member and an internal coil supported by the support member, the internal coil includes an upper coil disposed on one surface of the support member and a lower coil disposed on the other surface thereof, and the upper and lower coils are connected to each other by a via electrode. Heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction.
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公开(公告)号：US20140102766A1
公开(公告)日：2014-04-17
申请号：US13831534
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Da Hee Kim , Yoong Oh , Ki Young Yoo , Han Ul Lee , Myung Sam Kang , Ki Hwan Kim
CPC classification number: H05K3/46 , H05K1/0298 , H05K3/4647 , H05K3/4682 , H05K2203/025 , H05K2203/0733 , Y10T29/49155
Abstract: Disclosed herein is a multi-layer type coreless substrate, including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated on one surface or both surfaces of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting a pillar disposed on an outermost insulating layer of the plurality of insulating layers.
Abstract translation: 本文公开了一种多层型无芯基板，包括：第一绝缘层，其包括至少一个第一柱; 层叠在第一绝缘层的一个表面或两个表面上的多个绝缘层，每个绝缘层包括至少一个电路层和至少另一个连接到电路层的柱; 以及与设置在所述多个绝缘层的最外绝缘层上的柱接触的多个最外层电路层。
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