SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS
    4.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS 有权
    半导体器件,包括单位支持

    公开(公告)号:US20150041973A1

    公开(公告)日:2015-02-12

    申请号:US14336334

    申请日:2014-07-21

    IPC分类号: H01L23/00 H01L49/02

    摘要: A semiconductor device includes a plurality of cylindrical structures located at vertices and central points of a plurality of hexagons in a honeycomb pattern, and a unitary support having a plurality of openings. Each of the openings exposes a part each of four of the cylindrical structures. Each of the openings has the shape of a parallelogram or an oval substantially. A first distance between opposite cylindrical structures of a first pair of the four cylindrical structures exposed by each opening is shorter than a second distance between opposite cylindrical structures of a second pair of the four cylindrical structures exposed by the opening. The first distance is equal to a distance between the central point and each of the vertices of the hexagon.

    摘要翻译: 半导体器件包括位于蜂窝状图案的多个六边形的顶点和中心点处的多个圆柱形结构,以及具有多个开口的单一支撑件。 每个开口暴露四个圆柱形结构中的每一个的一部分。 每个开口都具有平行四边形或椭圆形的形状。 由每个开口暴露的第一对四个圆柱形结构的相对的圆柱形结构之间的第一距离比通过开口暴露的第四对圆柱形结构的第二对的圆柱形结构之间的第二距离短。 第一个距离等于六边形的中心点和每个顶点之间的距离。