公开(公告)号：US12136563B2

公开(公告)日：2024-11-05

申请号：US17315604

申请日：2021-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mingu Lee ,  Chulhyun Park ,  Kangsan Lee ,  Eunhaeng Lee ,  Euisun Choi

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/68

Abstract: A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.

公开(公告)号：US11581202B2

公开(公告)日：2023-02-14

申请号：US17078190

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Chulhyun Park ,  Minjae Shin ,  Geunsik Oh ,  Hyunjin Lee ,  Soonwon Lee ,  Nungpyo Hong

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

公开(公告)号：US20220102185A1

公开(公告)日：2022-03-31

申请号：US17315604

申请日：2021-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mingu Lee ,  Chulhyun Park ,  Kangsan Lee ,  Eunhaeng Lee ,  Euisun Choi

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/677

Abstract: A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.