公开(公告)号：US11581202B2

公开(公告)日：2023-02-14

申请号：US17078190

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Chulhyun Park ,  Minjae Shin ,  Geunsik Oh ,  Hyunjin Lee ,  Soonwon Lee ,  Nungpyo Hong

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

公开(公告)号：US20210159112A1

公开(公告)日：2021-05-27

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  H01J37/20

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

公开(公告)号：US11984344B2

公开(公告)日：2024-05-14

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01J37/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68742 ,  H01J37/20 ,  H01L21/67242 ,  H01L21/6831 ,  H01J2237/334

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

公开(公告)号：US09553069B2

公开(公告)日：2017-01-24

申请号：US14852825

申请日：2015-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Donggil Shim ,  Geunsik Oh ,  Youngjoo Lee ,  Junho Lee ,  Sukwon Lee

IPC: B23K37/04 ,  H01L23/00 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K3/087 ,  B23K37/04 ,  H01L2224/75252 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/7598

Abstract: A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.

Abstract translation: 基板制造装置的接合装置包括上层，与上层相对的下层，其构造为专用于支撑半导体芯片堆叠的被处理基板（设置），以及用于升高下层相对的升降机构 以提供将基板和芯片彼此挤压的压力。