公开(公告)号：US20170236798A1

公开(公告)日：2017-08-17

申请号：US15349327

申请日：2016-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： GUN-AH LEE ,  Jl-HWAN HWANG ,  CHA-JEA JO ,  DONG-HAN KIM ,  SEUNG-KON MOK

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6838 ,  H01L21/67144 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75702 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2225/06513 ,  H01L2924/07802 ,  H01L2924/1434 ,  H01L2924/15174 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion.