公开(公告)号：US20210159310A1

公开(公告)日：2021-05-27

申请号：US17147542

申请日：2021-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-suk LEE ,  Ji-won YU ,  Ji-woon PARK

IPC: H01L49/02 ,  H01L27/108 ,  H01L27/10

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

公开(公告)号：US20190333985A1

公开(公告)日：2019-10-31

申请号：US16508695

申请日：2019-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-suk LEE ,  Ji-won YU ,  Ji-woon PARK

IPC: H01L49/02 ,  H01L27/108

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

公开(公告)号：US20170337016A1

公开(公告)日：2017-11-23

申请号：US15259574

申请日：2016-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-suk LEE ,  Hee-jung KIM ,  Ju-won MIN ,  In-ho LEE

IPC: G06F3/12 ,  H04N1/00 ,  G06Q20/14

CPC classification number: G06F3/1203 ,  G06F3/1204 ,  G06F3/1222 ,  G06F3/1267 ,  G06F3/1273 ,  G06F3/129 ,  G06Q20/14 ,  H04N1/00408 ,  H04N2201/0094

Abstract: A printing method of an image forming apparatus is provided. The printing method includes receiving, from one of an external apparatus and a server connected to the external apparatus, job information and first identification (ID) information related to printing of content, receiving, from a user, second ID information, transmitting accounting information based on the job information to a billing system, when the second ID information received from the user and the first ID information received from one of the external apparatus and the server correspond to each other, and printing the content based on the job information, when payment completion information regarding payment by the user is received from the billing system.

公开(公告)号：US20130042097A1

公开(公告)日：2013-02-14

申请号：US13650715

申请日：2012-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kun-hoon BAIK ,  Ji-Sub PARK ,  Joung-hoon CHOO ,  Hyun-suk LEE

IPC: G06F9/44

CPC classification number: G06F9/4401 ,  G06F8/654 ,  G06F9/4418

Abstract: A method of updating a boot image for fast booting an image forming apparatus. In the method, when a request for changing software installed in the image forming apparatus is received, a boot image is deleted from the image forming apparatus and the boot image is re-generated by rebooting the image forming apparatus.

Abstract translation: 一种更新启动图像以快速启动图像形成装置的方法。 在该方法中，当接收到安装在图像形成装置中的更改软件的请求时，从图像形成装置中删除引导图像，并且通过重新启动图像形成装置来重新生成引导图像。

公开(公告)号：US20240234485A1

公开(公告)日：2024-07-11

申请号：US18614935

申请日：2024-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-goo KANG ,  Hyun-suk LEE ,  Gi-hee CHO

IPC: H01G4/30 ,  H10B12/00

CPC classification number: H01L28/75 ,  H01L28/60 ,  H01L28/87 ,  H01L28/88 ,  H01L28/90 ,  H10B12/0335 ,  H10B12/31

Abstract: An integrated circuit device includes a conductive region on a substrate and a lower electrode structure including a main electrode part spaced apart from the conductive region and a bridge electrode part between the main electrode part and the conductive region. A dielectric layer contacts an outer sidewall of the main electrode part. To manufacture the integrated circuit device, a preliminary bridge electrode layer is formed in a hole of a mold pattern on the substrate, and the main electrode part is formed on the preliminary bridge electrode layer in the hole. The mold pattern is removed to expose a sidewall of the preliminary bridge electrode layer, and a portion of the preliminary electrode part is removed to form the bridge electrode part. The dielectric layer is formed to contact the outer sidewall of the main electrode part.

公开(公告)号：US20180019125A1

公开(公告)日：2018-01-18

申请号：US15651068

申请日：2017-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-won YU ,  Hyun-suk LEE ,  Ji-woon PARK ,  Gi-hee CHO ,  Hee-sook PARK ,  Woong-hee SOHN

IPC: H01L21/205 ,  H01L21/54 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/205 ,  C23C16/045 ,  C23C16/4408 ,  C23C16/45527 ,  H01L21/54 ,  H01L21/67017 ,  H01L21/6719 ,  H01L21/67739 ,  H01L21/67769

Abstract: A method of manufacturing a semiconductor device, the method including supplying a first reactant to inside a processing chamber into which a substrate has been introduced; controlling a flow of a first purge gas and storing the first purge gas, of which flow has been controlled, in a first storage for a given time period; supplying the first purge gas from the first storage to the inside of the processing chamber after supplying the first reactant; and supplying a second reactant to the inside of the processing chamber after supplying the first purge gas.

公开(公告)号：US20210273041A1

公开(公告)日：2021-09-02

申请号：US17323433

申请日：2021-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-goo KANG ,  Hyun-suk LEE ,  Gi-hee CHO

IPC: H01L49/02 ,  H01L27/108

Abstract: An integrated circuit device includes a conductive region on a substrate and a lower electrode structure including a main electrode part spaced apart from the conductive region and a bridge electrode part between the main electrode part and the conductive region. A dielectric layer contacts an outer sidewall of the main electrode part. To manufacture the integrated circuit device, a preliminary bridge electrode layer is formed in a hole of a mold pattern on the substrate, and the main electrode part is formed on the preliminary bridge electrode layer in the hole. The mold pattern is removed to expose a sidewall of the preliminary bridge electrode layer, and a portion of the preliminary electrode part is removed to form the bridge electrode part. The dielectric layer is formed to contact the outer sidewall of the main electrode part.

公开(公告)号：US20180019300A1

公开(公告)日：2018-01-18

申请号：US15448683

申请日：2017-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-suk LEE ,  Ji-won YU ,  Ji-woon PARK

IPC: H01L49/02 ,  H01L23/535 ,  H01L27/108

CPC classification number: H01L28/75 ,  H01L23/535 ,  H01L27/10805 ,  H01L27/1085 ,  H01L27/10852 ,  H01L28/90

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.