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公开(公告)号：US20230087072A1
公开(公告)日：2023-03-23
申请号：US17736173
申请日：2022-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangmin Kang , Hyungjoon Kim , WooJin Jang
IPC: H01L27/11582 , H01L27/11519 , H01L27/11524 , H01L27/11526 , H01L27/11556 , H01L27/11565 , H01L27/1157 , H01L27/11573
Abstract: A method of fabricating an integrated circuit device includes forming on a semiconductor substrate a mold stack that includes a plurality of insulating layers and a plurality of mold layers alternately arranged. A mask pattern including an opening is formed on the mold stack. A channel hole is formed by removing the mold stack exposed through the opening. A sacrificial film is formed on a lateral wall of the mold stack exposed through the channel hole. An oxidation process is performed on the sacrificial film and the mold stack to convert the sacrificial film to a sacrificial oxide film. An etching process is performed to remove the sacrificial oxide film.
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公开(公告)号：US11349211B2
公开(公告)日：2022-05-31
申请号：US16796415
申请日：2020-02-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghwan Yeom , Hyungjoon Kim , Jinsuk Jang
Abstract: Disclosed is an electronic device which performs wireless communication and includes a first antenna configured to transmit and receive a signal in a first frequency band, a conductive member disposed to be spaced from the first antenna as much as a first distance, a printed circuit board disposed parallel to a first surface of the conductive member, and at least one conductive connection member interposed between the conductive member and the printed circuit board, wherein the conductive member is gap fed from the first antenna and operates as a radiator for wireless communication.
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3.发明授权公开(公告)号：US10664578B2
公开(公告)日：2020-05-26
申请号：US14615953
申请日：2015-02-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heejun You , Taeho Kim , Hyungjoon Kim , Seulhan Park , Jonghoon Park , Teain An , Yangsoo Lee , Moonsu Chang , Jinho Hyeon , Seunghwan Kim
Abstract: A method is provided that inputs/outputs security information to/from an electronic device. The security information inputting method includes sensing a motion for inputting security information by a sensor module; creating an interrupt according to the security information inputting motion; and reading the security information by a security information inputting module, in response to the interrupt.
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公开(公告)号：US20230164999A1
公开(公告)日：2023-05-25
申请号：US17962577
申请日：2022-10-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangmin Kang , Junghwan Kim , Hyungjoon Kim , Jihoon Choi
IPC: H01L27/11582 , H01L27/1157 , H01L27/11556 , H01L27/11524 , H01L23/528
CPC classification number: H01L27/11582 , H01L27/1157 , H01L27/11556 , H01L27/11524 , H01L23/5283
Abstract: A semiconductor device includes gate electrodes on a substrate and a memory channel structure extending through the gate electrodes. The gate electrodes are spaced apart from each other in a vertical direction substantially perpendicular to an upper surface of the substrate. The memory channel structure extends in the vertical direction on the substrate. The memory channel structure includes a first filling pattern extending in the vertical direction, a channel on a sidewall of the first filling pattern, and a charge storage structure on a sidewall of the channel. The first filling pattern includes a material having a thermal conductivity equal to or more than about 100 W/m·K at a temperature of about 25° C.
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公开(公告)号：US11151288B2
公开(公告)日：2021-10-19
申请号：US15718826
申请日：2017-09-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Teain An , Taeho Kim , Hyungjoon Kim , Seulhan Park , Jonghoon Park , Heejun You , Yangsoo Lee , Moonsu Chang , Jinho Hyeon
Abstract: A method and apparatus for processing biometric information in an electronic device including a processor that operates at a normal mode or at a secure mode, the method comprising, detecting a biometric input event from a biometric sensor module at normal mode, creating biometric data based on sensed data from the biometric sensor module at the secure mode, performing biometric registration or biometric authentication based on the created biometric data at the secure mode, and providing result information of biometric registration or biometric authentication at the normal mode.
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Patent Agency Ranking
6.发明授权公开(公告)号：US10971335B2
公开(公告)日：2021-04-06
申请号：US16661579
申请日：2019-10-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyungjoon Kim , Myoungwoon Kim , Hee jong Jeong
Abstract: A radio frequency (RF) power monitoring device includes an RF sensor to monitor RF power transferred to a target load and an impedance of the target load and a transmission line to electrically connect the RF sensor to the target load and to transfer the RF power to the target load. A phase (φz) of the impedance of the target load is adjusted to satisfy a range of −30°+180°*n
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公开(公告)号：US20210028543A1
公开(公告)日：2021-01-28
申请号：US16796415
申请日：2020-02-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghwan YEOM , Hyungjoon Kim , Jinsuk Jang
Abstract: Disclosed is an electronic device which performs wireless communication and includes a first antenna configured to transmit and receive a signal in a first frequency band, a conductive member disposed to be spaced from the first antenna as much as a first distance, a printed circuit board disposed parallel to a first surface of the conductive member, and at least one conductive connection member interposed between the conductive member and the printed circuit board, wherein the conductive member is gap fed from the first antenna and operates as a radiator for wireless communication.
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公开(公告)号：US09741758B2
公开(公告)日：2017-08-22
申请号：US14605243
申请日：2015-01-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyungjoon Kim , Hyoungsun Park
IPC: H01L27/146
CPC classification number: H01L27/1463 , H01L27/14609 , H01L27/1462 , H01L27/14621 , H01L27/14627 , H01L27/1464 , H01L27/14685 , H01L27/14689
Abstract: A method of forming an image sensor can be provided by forming a respective photoelectric conversion region in each of a plurality of unit pixel regions of a substrate and depositing a material configured to provide a negative fixed charge layer on the photoelectric conversion region.
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公开(公告)号：US12197628B2
公开(公告)日：2025-01-14
申请号：US18328412
申请日：2023-06-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Teain An , Taeho Kim , Hyungjoon Kim , Seulhan Park , Jonghoon Park , Heejun You , Yangsoo Lee , Moonsu Chang , Jinho Hyeon
Abstract: A method and apparatus for processing biometric information in an electronic device including a processor that operates at a normal mode or at a secure mode, the method comprising, detecting a biometric input event from a biometric sensor module at normal mode, creating biometric data based on sensed data from the biometric sensor module at the secure mode, performing biometric registration or biometric authentication based on the created biometric data at the secure mode, and providing result information of biometric registration or biometric authentication at the normal mode.
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公开(公告)号：US20230066186A1
公开(公告)日：2023-03-02
申请号：US17893274
申请日：2022-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangmin Kang , Hyungjoon Kim , Sangsoo Lee , Woojin Jang , Dongsung Choi
IPC: H01L27/11582 , G11C16/04 , H01L27/11519 , H01L27/11524 , H01L27/11526 , H01L27/11556 , H01L27/11565 , H01L27/1157 , H01L27/11573
Abstract: A semiconductor device and a method of manufacturing the same. The method may include: forming a mold stack that includes a plurality of insulating layers alternately arranged with a plurality of sacrificial layers; forming a preliminary pad portion by sequentially patterning the mold stack; forming a cell contact hole that extends through the preliminary pad portion and the sacrificial layer portions; forming a first extension portion and a plurality of second extension portions by laterally expanding the preliminary pad portion and the sacrificial layer portions; forming a first insulating liner and a sacrificial ring pattern in the first extension portion; forming an oxide liner and an insulating ring pattern in the second extension portions; forming a sacrificial plug within the cell contact hole; and replacing the sacrificial layers with gate electrodes and replacing the preliminary pad portion, the first insulating liner, and the sacrificial ring pattern with a pad portion.
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