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1.发明授权公开(公告)号：US10460436B2
公开(公告)日：2019-10-29
申请号：US15691958
申请日：2017-08-31
发明人： Younghoon Sohn , Ilsoo Kim , Yusin Yang
IPC分类号： G06T7/00 , H01L21/66 , H01L23/498 , H01L23/00
摘要： Disclosed are an inspection method, an inspection system, and a method of fabricating a semiconductor package using the same. The inspection method comprises obtaining a reference value by measuring a surface profile of a reference pattern, scanning reference images of the reference pattern by using a plurality of optical inspection conditions, obtaining estimation values of the reference pattern that are measured from the reference images, selecting an desired optical inspection condition among the plurality of optical inspection conditions by comparing the reference value with the estimation values, scanning a target image of a target pattern by using the desired optical inspection condition, and obtaining an error value by quantitatively comparing the target image with a design image of the target pattern.
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2.发明申请公开(公告)号：US20180101940A1
公开(公告)日：2018-04-12
申请号：US15691958
申请日：2017-08-31
发明人： Younghoon SOHN , Ilsoo Kim , Yusin Yang
CPC分类号： G06T7/001 , G06T2207/30148 , H01L21/4857 , H01L22/12 , H01L22/20 , H01L23/13 , H01L23/498 , H01L23/49816 , H01L23/49822 , H01L24/97 , H01L2924/15311
摘要： Disclosed are an inspection method, an inspection system, and a method of fabricating a semiconductor package using the same. The inspection method comprises obtaining a reference value by measuring a surface profile of a reference pattern, scanning reference images of the reference pattern by using a plurality of optical inspection conditions, obtaining estimation values of the reference pattern that are measured from the reference images, selecting an desired optical inspection condition among the plurality of optical inspection conditions by comparing the reference value with the estimation values, scanning a target image of a target pattern by using the desired optical inspection condition, and obtaining an error value by quantitatively comparing the target image with a design image of the target pattern.
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公开(公告)号：US10593648B2
公开(公告)日：2020-03-17
申请号：US16024940
申请日：2018-07-02
发明人： Ilsoo Kim , Heeyoub Kang , Young-Rok Oh , Kitaek Lee , Hwi-Jong Yoo
IPC分类号： H01L25/065 , H01L23/36 , H01L23/373 , H01L23/544 , H01L25/10 , H05K1/18
摘要： A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
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公开(公告)号：US10529692B2
公开(公告)日：2020-01-07
申请号：US15812482
申请日：2017-11-14
发明人： Ilsoo Kim , Heeyoub Kang , Young-Rok Oh , Kitaek Lee , Hwi-Jong Yoo
IPC分类号： H01L25/065 , H01L23/36 , H01L23/373
摘要： A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
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