SEMICONDUCTOR DEVICE
    3.
    发明公开

    公开(公告)号:US20230298945A1

    公开(公告)日:2023-09-21

    申请号:US17961172

    申请日:2022-10-06

    IPC分类号: H01L21/8238

    摘要: A semiconductor device may include first and second channel patterns, which are provided on first and second active patterns, respectively, and include first semiconductor patterns and second semiconductor patterns, respectively, and a gate electrode crossing over the first and second channel patterns in a first direction. The gate electrode may include first and second outer gate electrodes, which are provided on the uppermost ones of the first and second semiconductor patterns, respectively, and each of which includes a first metal pattern, a second metal pattern thinner than the first metal pattern, and a filling metal pattern sequentially stacked. A third metal pattern may be further provided between the first metal pattern and the first semiconductor patterns. The third and second metal patterns may include p- and n-type work function metals, respectively. The first and second metal patterns of the second outer gate electrode may have coplanar topmost surfaces.