公开(公告)号：US20240282576A1

公开(公告)日：2024-08-22

申请号：US18535594

申请日：2023-12-11

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Hyungju RYU ,  Sangjin KIM ,  Yigwon KIM ,  Jongsu KIM

IPC: H01L21/027 ,  G03F7/00 ,  H01L21/304

CPC classification number: H01L21/0274 ,  G03F7/70625 ,  G03F7/70633 ,  H01L21/3043

Abstract: A method of manufacturing a semiconductor device includes bonding a first semiconductor substrate on a second semiconductor substrate; performing a first physical parameter measurement on a first surface of the first semiconductor substrate to obtain first displacement data; polishing the first surface of the first semiconductor substrate after the first displacement data is obtained; performing a second physical parameter measurement on the polished first surface of the first semiconductor substrate to obtain second displacement data; and forming circuit patterns on the polished first surface of the first semiconductor substrate based on the second displacement data.

公开(公告)号：US20250006654A1

公开(公告)日：2025-01-02

申请号：US18630178

申请日：2024-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghye BAEK ,  Jeonghyun KIM ,  Hyunjae KANG ,  Ilhwan KIM ,  Jongsu KIM ,  Youngsik PARK ,  Muyoung LEE ,  Sangho JO

IPC: H01L23/544

Abstract: A semiconductor device includes a semiconductor substrate, a first test pattern disposed on the semiconductor substrate, and a second test pattern located adjacent to the first test pattern. The first test pattern includes an overlay pattern, and the second test pattern includes a test element group.

公开(公告)号：US20240321884A1

公开(公告)日：2024-09-26

申请号：US18442590

申请日：2024-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inhyun SONG ,  Junggil YANG ,  Sangmoon LEE ,  Myunggil KANG ,  Jongsu KIM ,  Beomjin PARK

IPC: H01L27/092 ,  H01L21/8238 ,  H01L29/06 ,  H01L29/423 ,  H01L29/49 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L27/092 ,  H01L21/823807 ,  H01L21/823842 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/4908 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/78696

Abstract: Provided is a semiconductor device including a substrate, a fin-type active region protruding on the substrate, a channel region on the fin-type active region and including a plurality of active patterns extending in a first horizontal direction and a semiconductor material layer, a gate line extending in a second horizontal direction that is perpendicular to the first horizontal direction and covering the channel region on the fin-type active region, and a pair of source/drain regions at both sides of the gate line on the fin-type active region, wherein a work function of the semiconductor material layer is different from a work function of the plurality of active patterns, the semiconductor material layer surrounds portions of the gate line between the plurality of active patterns, and the gate line is separated from the pair of source/drain regions with the semiconductor material layer therebetween.

公开(公告)号：US20210074594A1

公开(公告)日：2021-03-11

申请号：US16847727

申请日：2020-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junbum PARK ,  Younghwan KIM ,  Jongsu KIM ,  Youngjoo LEE ,  Yoojin JEONG

IPC: H01L21/66 ,  G01B11/06 ,  H01J37/32 ,  G01N21/95

Abstract: A semiconductor substrate measuring apparatus includes a light source to generate irradiation light having a sequence of on/off at a predetermined interval, the light source to provide the irradiation light to a chamber with an internal space for processing a semiconductor substrate using plasma, an optical device between the light source and the chamber, the optical device to split a first measurement light into a first optical path, condensed while the light source is turned on, to split a second measurement light into a second optical path, condensed while the light source is turned off, and to synchronize with the on/off sequence, and a photodetector connected to the first and second optical paths, the photodetector to subtract spectra of first and second measurement lights to detect spectrum of reflected light, and to detect plasma emission light emitted from the plasma based on the spectrum of the second measurement light.

公开(公告)号：US20200319025A1

公开(公告)日：2020-10-08

申请号：US16751356

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongsu KIM ,  Younghwan KIM ,  Junbum PARK ,  Youngjoo LEE ,  Sungho JANG

IPC: G01J3/02 ,  G01J3/10 ,  G02B27/14

Abstract: An optical emission spectroscopy (OES) calibration system includes a chamber, an adapter, an OES device, a calibration device, and a spectrometer. The chamber includes a viewport. The adapter is fastened to the viewport, and includes a first beam splitter and a second beam splitter. The OES device detects plasma light generated in the chamber and transmitted through the adapter and generates OES data based on the detected plasma light. The calibration device includes a light source, and generates correction data for compensating for deviations in the OES data. The spectrometer detects light emitted from the light source and split by the first beam splitter or the second beam splitter. Each of the OES device, the calibration device, and the spectrometer is fastened to the adapter through an optical cable, and the calibration device generates the correction data using an intensity of light detected by the spectrometer.

公开(公告)号：US20230114336A1

公开(公告)日：2023-04-13

申请号：US17903564

申请日：2022-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gawon LEE ,  Daehaeng CHO ,  Seunghyeon CHO ,  Jongsu KIM

IPC: G06Q20/40

Abstract: An electronic device is provided. The electronic device includes a communication module communicable with an external device, a display, a memory, and at least one processor operatively connected to the communication module, wherein the at least one processor is configured to display at least one image and/or text related to payment information on the display in response to at least a part of a user input, determine whether to start a payment process in response to identification of a user authentication, transmit a first signal for requesting an authentication to the external device in response to identification of an approach of the external device within a predetermined distance from the electronic device, and transmit a second signal related to the payment process in response to identification of an authentication of the external device, and determine whether to complete the payment process using the electronic device.

公开(公告)号：US20240355883A1

公开(公告)日：2024-10-24

申请号：US18385537

申请日：2023-10-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyumin YOO ,  Myung Gil KANG ,  Dongwon KIM ,  Jongsu KIM ,  Beomjin PARK ,  Byeonghee SON

IPC: H01L29/08 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/0847 ,  H01L21/823814 ,  H01L27/092 ,  H01L29/775 ,  H01L29/78696 ,  H01L29/0653

Abstract: A semiconductor device includes a substrate including an active pattern; a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns, which are stacked to be spaced apart from each other; a source/drain pattern connected to the plurality of semiconductor patterns; a gate electrode on the plurality of semiconductor patterns; and a blocking layer between the source/drain pattern and the active pattern, wherein the source/drain pattern includes a protruding side surface protruding toward the semiconductor patterns, the blocking layer includes silicon-germanium (SiGe), and a germanium concentration of the blocking layer is higher than a germanium concentration of the source/drain pattern.

公开(公告)号：US20230166299A1

公开(公告)日：2023-06-01

申请号：US17870340

申请日：2022-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongsu KIM ,  Johnho KUK ,  Sunil PARK ,  Kwangsung LEE ,  Yoichiro IWA ,  Sewon JEON ,  Youngho JUNG

IPC: B08B3/02 ,  B24B37/005

CPC classification number: B08B3/02 ,  B24B37/0053

Abstract: A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.

公开(公告)号：US20230029025A1

公开(公告)日：2023-01-26

申请号：US17848905

申请日：2022-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donghoon LEE ,  Hakhyun KIM ,  Daehaeng CHO ,  Eunyoung KWON ,  Jongsu KIM

IPC: G06F11/14 ,  H04L9/08 ,  H04L9/32

Abstract: According to certain embodiments, an electronic device comprises: a secure element storing at least one content application and backup data associated with the at least one content application; a memory storing instructions; and a processor electrically connected to the secure element and the memory and configured to executed the instructions, wherein execution of the instructions by the processor causes the processor to perform a plurality of operations comprising: when receiving a message requesting a backup operation from an external electronic device, loading encrypted backup data from the secure element, transmitting the backup data to the external electronic device, and when receiving a message about backup completion from the external electronic device, setting the backup data to an unavailable state.

公开(公告)号：US20220035921A1

公开(公告)日：2022-02-03

申请号：US17277600

申请日：2019-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeckki LEE ,  Jongsu KIM ,  Eunyoung KWON ,  Dasom LEE ,  Daehaeng CHO

IPC: G06F21/57 ,  G06F21/71 ,  G06F21/78

Abstract: Various embodiments of the present invention relate to an electronic device for providing a service by using a secure element, and an operating method thereof. The electronic device comprises: a processor for acquiring secure state information of the electronic device; and a secure element operating under the control of the processor, receiving the secure state information of the electronic device from the processor, and including a repository for storing the received secure state information of the electronic device, wherein the secure element senses a security-related service request command, acquires the secure state information about the electronic device from the repository, and can process or ignore the sensed security-related service request command on the basis of whether the acquired secure state information of the electronic device satisfies a designated condition. Other embodiments are also possible.