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公开(公告)号：US20240105694A1
公开(公告)日：2024-03-28
申请号：US18464608
申请日：2023-09-11
发明人： Jung Hoo YUN , Jae Moon LIM
IPC分类号： H01L25/16 , H01L21/027 , H01L23/00 , H01L23/13 , H01L23/498
CPC分类号： H01L25/16 , H01L21/0273 , H01L23/13 , H01L23/49816 , H01L23/49822 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/11462 , H01L2224/13023 , H01L2224/13564 , H01L2224/1357 , H01L2224/16227 , H01L2224/16265 , H01L2224/1703 , H01L2224/32225 , H01L2224/32265 , H01L2224/73204 , H01L2224/81203 , H01L2924/19041 , H01L2924/19103 , H01L2924/351
摘要： A semiconductor package includes a semiconductor chip including a first area and a second area around the first area, and a substrate including a second surface, the second surface facing a first surface of the semiconductor chip, a first trench defined on the second surface, and the first trench at least partially overlapping the second area of the semiconductor chip. The semiconductor package includes a bump structure including first bumps on the first area of the semiconductor chip, and second bumps on the second area of the semiconductor chip, the bump structure between the substrate and the semiconductor chip, and a first passive device in the first trench. The second bumps are in contact with the first surface of the semiconductor chip and the first passive device.
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公开(公告)号：US20190206364A1
公开(公告)日：2019-07-04
申请号：US16235775
申请日：2018-12-28
发明人： Young Hoon JEONG , Jae Moon LIM , Joseph KIM , Chun ZHAO
IPC分类号： G09G5/10 , G06F3/14 , G09G3/20 , G06T5/00 , G09G3/3208
CPC分类号： G09G5/10 , G06F3/1446 , G06T5/009 , G09G3/2096 , G09G3/32 , G09G3/3208 , G09G2300/026 , G09G2320/0242 , G09G2320/0271 , G09G2320/0626 , G09G2320/066 , G09G2330/021 , G09G2360/16
摘要： An image processing apparatus for minimizing a collective amount of power consumed by a plurality of display apparatuses of a multi-screen system to display an image of the multi-screen system, and for optimizing hue and luminance of the image of the multi-screen system.
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