公开(公告)号：US20200286727A1

公开(公告)日：2020-09-10

申请号：US16881113

申请日：2020-05-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hoon JEONG ,  Jung-Min OH ,  Kun-Tack LEE ,  Hyo-San LEE

IPC: H01L21/02 ,  H01L21/67

Abstract: A method of processing substrates, comprising: loading a substrate into a process chamber; supplying a supercritical fluid, that is a process fluid under the supercritical state, into the process chamber, chemicals separated from the substrate and the supercritical fluid being mixed into a supercritical mixture in the process chamber; and gradually decreasing a chemical concentration of the supercritical mixture by alternately repeating a pressure drop mode and a supplemental mode such that the supercritical mixture partially flows out from the process chamber at the pressure drop mode when an inner pressure of the process chamber reaches a first pressure and the supercritical fluid turbulently flows into the process chamber at the supplemental mode when the inner pressure of the process chamber reaches a second pressure that is smaller than the first pressure and over a supercritical pressure of the process fluid.

公开(公告)号：US20190019669A1

公开(公告)日：2019-01-17

申请号：US16133789

申请日：2018-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hoon JEONG ,  Jung-Min OH ,  Kun-Tack LEE ,  Hyo-San LEE

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67017

Abstract: Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which a supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.

公开(公告)号：US20180267409A1

公开(公告)日：2018-09-20

申请号：US15986901

申请日：2018-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Min OH ,  Mi-Hyun PARK ,  Hyo-San LEE ,  Ji-Hoon JEONG ,  Yong-Sun KO ,  In-Gi KIM ,  Na-Rim KIM ,  Sang-Tae KIM ,  Seong-Min KIM ,  Kyong-Ho LEE

IPC: G03F7/42 ,  H01L29/16 ,  H01L21/8238 ,  H01L21/311 ,  G03F7/039 ,  H01L21/266

CPC classification number: G03F7/426 ,  G03F7/039 ,  G03F7/42 ,  G03F7/422 ,  G03F7/425 ,  H01L21/266 ,  H01L21/31133 ,  H01L21/823814 ,  H01L21/823828 ,  H01L29/16

Abstract: A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.

公开(公告)号：US20170069513A1

公开(公告)日：2017-03-09

申请号：US15168713

申请日：2016-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Min OH ,  Mi-Hyun PARK ,  ln-Gi KIM ,  Ji-Hoon JEONG ,  Seok-Hoon KIM ,  Hyo-San LEE

IPC: H01L21/67 ,  B08B3/08 ,  C11D7/34 ,  C11D11/00 ,  C11D7/32 ,  H01L21/02 ,  B08B3/14

CPC classification number: H01L21/67051 ,  C11D7/265 ,  C11D7/28 ,  C11D7/3209 ,  C11D7/34 ,  C11D7/5004 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67017

Abstract: A semiconductor cleaning process system includes a process chamber configured to hold a semiconductor substrate, a cleaning solution supply unit configured to provide a cleaning solution to the process chamber, the cleaning solution including an organic fluoride, an organic acid and an organic solvent, a recycling unit configured to collect the cleaning solution discharged from the process chamber, a first concentration measuring unit configured to evaluate a fluorine concentration of a collected solution in the recycling unit, and a sub-cleaning solution supply unit configured to provide the organic fluoride to the cleaning solution supply unit based on the fluorine concentration evaluated by the first concentration measuring unit.

Abstract translation: 半导体清洗处理系统包括：配置成保持半导体衬底的处理室，构造成向处理室提供清洁溶液的清洗溶液供应单元，包括有机氟化物，有机酸和有机溶剂的清洗溶液，循环利用 被配置为收集从处理室排出的清洗溶液的单元，被配置为评估回收单元中的收集溶液的氟浓度的第一浓度测量单元和被配置为将有机氟化物提供给清洁的辅助清洁溶液供应单元 溶液供应单元，其基于由第一浓度测量单元评估的氟浓度。