公开(公告)号：US20150348906A1

公开(公告)日：2015-12-03

申请号：US14581221

申请日：2014-12-23

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jong Kil PARK ,  Min Young SON

IPC分类号： H01L23/522 ,  H01L23/528

CPC分类号： H01L23/49827 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

摘要： An electronic device package may include a package body, an electronic device, and at least one conductive via. The package body includes a first surface and a second surface opposite to the first surface. The electronic device is disposed on the first surface. The at least one conductive via extends through the package body and includes a first end located in a mounting region of the first surface corresponding to a region on which the electronic device is disposed. The first end may have a first dimension measured along a first direction greater than a second dimension measured along a second direction substantially perpendicular to the first direction.

摘要翻译： 电子器件封装可以包括封装体，电子器件和至少一个导电通孔。 包装体包括与第一表面相对的第一表面和第二表面。 电子设备设置在第一表面上。 所述至少一个导电通孔延伸穿过所述封装主体并且包括位于所述第一表面的安装区域中的第一端，所述第一端对应于所述电子设备所在的区域。 第一端可以具有沿着第一方向测量的大于沿着基本上垂直于第一方向的第二方向测量的第二尺寸的第一尺寸。

公开(公告)号：US20130088863A1

公开(公告)日：2013-04-11

申请号：US13647905

申请日：2012-10-09

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jong Kil PARK ,  Bang Weon LEE ,  Tae Gyu KIM

IPC分类号： F21V21/00 ,  F21V29/00 ,  F21V15/00

CPC分类号： F21V19/0045 ,  F21K9/27 ,  F21K9/66 ,  F21V29/506 ,  F21V29/508 ,  F21V29/75 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2115/10

摘要： A lighting device may include a circuit substrate comprising a first surface and a light emitting device, and a cover to which the circuit substrate is installed, so as to receive the light emitting device. The cover includes at least one opening, and at least one portion of a second surface is exposed to an external side though the at least one opening.

摘要翻译： 照明装置可以包括包括第一表面和发光装置的电路基板以及安装电路基板的盖，以便接收发光装置。 所述盖包括至少一个开口，并且第二表面的至少一部分经由所述至少一个开口暴露于外侧。