公开(公告)号：US20240327136A1

公开(公告)日：2024-10-03

申请号：US18383656

申请日：2023-10-25

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Minkyun LEE ,  Seunggyu Kang ,  Hyunjae Kang ,  Sangmin Kim ,  Youngwook Kim ,  Jaesung Byun ,  Yongjun Ahn ,  Yongjun Ahn ,  Hyunwoo Lee ,  Jeonghun Lim ,  Junhyuk Chang

IPC分类号： B65G47/90 ,  H01L21/677 ,  H01L21/687

CPC分类号： B65G47/90 ,  H01L21/67712 ,  H01L21/67769 ,  H01L21/68707

摘要： An apparatus includes an elevator, a plurality of storages, a plurality of first robots and a plurality of second robots. The elevator may elevate a vehicle containing a plurality of semiconductor device carriers to position the vehicle at each of a plurality of process floors. At least one of the plurality of storages may be provided at each of the plurality of process floors to store the plurality of semiconductor device carriers. At least one of the plurality of first robots may be provided at each of the plurality of process floors to transfer the vehicle between the elevator and a respective one of the plurality of process floors. At least one of the second robots may be provided at each of the plurality of process floors to transfer at least one of the plurality of semiconductor device carriers between the vehicle and one of the plurality of storages.

公开(公告)号：US12033879B2

公开(公告)日：2024-07-09

申请号：US17683769

申请日：2022-03-01

申请人： Samsung Electronics Co., Ltd.

发明人： Sangmin Kim ,  Youngwook Kim ,  Ginam Park ,  Chuljun Park ,  Jeongjae Bang ,  Jaesung Byun ,  Yongjun Ahn ,  Sangkyung Lee ,  Hyunwoo Lee ,  Junhyuk Chang

IPC分类号： H01L21/677 ,  B65G1/06 ,  B65G1/127 ,  H01L21/673

CPC分类号： H01L21/67766 ,  B65G1/06 ,  B65G1/127 ,  H01L21/67379 ,  H01L21/6773 ,  B65G2201/0297

摘要： A transfer apparatus includes a lower plate including a lower link arm and a lower support, the lower support being fixed to an upper surface of the lower plate, an upper plate on the lower plate and configured to support a wafer stacking box on an upper surface of the upper plate, the upper plate including an upper link arm, and an upper support that is fixed to the upper surface of the upper plate, and a fixing member that is connected to the upper link arm, the fixing member configured to selectively contact the wafer stacking box. The upper plate is aligned with the lower plate in a first horizontal direction, and is configured to perform linear movement on the lower plate in the first horizontal direction.