公开(公告)号：US20240105536A1

公开(公告)日：2024-03-28

申请号：US18369474

申请日：2023-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seokbong PARK ,  Sechul PARK ,  Unbyoung KANG ,  Junhyun AN ,  Hyojin YUN ,  Seunghun CHAE

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/3107 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2924/15174

Abstract: A semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer on the first redistribution structure, the first molding layer including at least one lower recess in a top surface thereof and being disposed on the first semiconductor chip, connection structures on the first redistribution structure, the connection structures extending in a vertical direction and passing through the first molding layer, a first insulating layer on the first molding layer, and a second redistribution structure including a lower redistribution insulating layer on the first insulating layer, wherein the first insulating layer at least partially fills the at least one lower recess of the first molding layer.