公开(公告)号：US20160026090A1

公开(公告)日：2016-01-28

申请号：US14878034

申请日：2015-10-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chawon KOH ,  Su Min KIM ,  Hyunwoo KIM ,  Hyojin YUN

IPC: G03F7/40 ,  G03F7/20 ,  G03F7/32 ,  G03F7/16

CPC classification number: G03F7/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/426 ,  H01L21/0206

Abstract: A photolithographic rinse solution includes deionized water, and a surfactant, the surfactant including a cyclic amine group and at least one non-amine cyclic group joined to or fused with the cyclic amine group, wherein the cyclic amine group includes a ring having a carbon number of 4 to 6, and the non-amine cyclic group includes a ring having a carbon number of 5 to 8.

Abstract translation: 光刻冲洗液包括去离子水和表面活性剂，所述表面活性剂包括环胺基团和至少一个与环胺基团连接或稠合的非胺环状基团，其中所述环胺基团包括具有碳数的环 为4〜6，非胺环基包括碳数为5〜8的环。

公开(公告)号：US20230060115A1

公开(公告)日：2023-02-23

申请号：US17723552

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sechul PARK ,  Unbyoung KANG ,  Heewon KIM ,  Jongho PARK ,  Hyojin YUN ,  Juil CHOI

IPC: H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip on a base chip, a second semiconductor chip on the first semiconductor chip in a first direction, each of the first and second semiconductor chips including a TSV and being electrically connected to each other via the TSV, dam structures on the base chip and surrounding a periphery of the first semiconductor chip, a first adhesive film between the base chip and the first semiconductor chip, a portion of the first adhesive film filling a space between the first semiconductor chip and the dam structures, a second adhesive film between the first semiconductor chip and the second semiconductor chip, a portion of the second adhesive film overlapping the dam structures in the first direction, and an encapsulant encapsulating a portion of each of the dam structures, the first semiconductor chip, and the second semiconductor chip.

公开(公告)号：US20240105536A1

公开(公告)日：2024-03-28

申请号：US18369474

申请日：2023-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seokbong PARK ,  Sechul PARK ,  Unbyoung KANG ,  Junhyun AN ,  Hyojin YUN ,  Seunghun CHAE

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/3107 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2924/15174

Abstract: A semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer on the first redistribution structure, the first molding layer including at least one lower recess in a top surface thereof and being disposed on the first semiconductor chip, connection structures on the first redistribution structure, the connection structures extending in a vertical direction and passing through the first molding layer, a first insulating layer on the first molding layer, and a second redistribution structure including a lower redistribution insulating layer on the first insulating layer, wherein the first insulating layer at least partially fills the at least one lower recess of the first molding layer.

公开(公告)号：US20140045335A1

公开(公告)日：2014-02-13

申请号：US13962173

申请日：2013-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chawon KOH ,  Su Min KIM ,  Hyunwoo KIM ,  Hyojin YUN

IPC: G03F7/42 ,  H01L21/02

CPC classification number: G03F7/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/426 ,  H01L21/0206

Abstract: A photolithographic rinse solution includes deionized water, and a surfactant, the surfactant including a cyclic amine group and at least one non-amine cyclic group joined to or fused with the cyclic amine group, wherein the cyclic amine group includes a ring having a carbon number of 4 to 6, and the non-amine cyclic group includes a ring having a carbon number of 5 to 8.

Abstract translation: 光刻冲洗液包括去离子水和表面活性剂，所述表面活性剂包括环胺基和至少一个与环胺基连接或稠合的非胺环基，其中所述环胺基包括具有碳数的环 为4〜6，非胺环基包括碳数为5〜8的环。