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公开(公告)号：US20150085529A1
公开(公告)日：2015-03-26
申请号：US14558323
申请日：2014-12-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kun Yoo KO , Masaaki SOFUE
CPC classification number: H01L33/504 , C09K11/06 , G02B6/0068 , G02B6/0073 , H01L33/52 , H05B33/12
Abstract: A white light emitting device includes: a blue light emitting diode (LED) which emits blue light; and a resin packing unit which encapsulates the blue LED, wherein the resin packing unit includes a first wavelength conversion material which, in response to being excited by the blue light, emits green light, a second wavelength conversion material which, in response to being excited by the blue light, emits red light, and a complex compound which absorbs light of a region in which the green light and the red light are mixed, the light of the region being included in white light implemented through a mixture of the green light and the red light excited together with the blue light.
Abstract translation: 白色发光器件包括：蓝色发光二极管（LED），其发射蓝色光; 以及封装蓝色LED的树脂填充单元，其中，所述树脂填充单元包括响应于被蓝色光激发而发出绿色光的第一波长转换材料，响应于被激发的第二波长转换材料 通过蓝光发射红光，以及复合化合物，其吸收其中混合有绿光和红光的区域的光，该区域的光包含在通过绿光和 红光与蓝光一起激发。
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公开(公告)号：US20130278134A1
公开(公告)日：2013-10-24
申请号：US13868628
申请日：2013-04-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kun Yoo KO , Masaaki SOFUE
CPC classification number: H01L33/504 , C09K11/06 , G02B6/0068 , G02B6/0073 , H01L33/52 , H05B33/12
Abstract: A white light emitting device includes: a blue light emitting diode (LED) which emits blue light; and a resin packing unit which encapsulates the blue LED, wherein the resin packing unit includes a first wavelength conversion material which, in response to being excited by the blue light, emits green light, a second wavelength conversion material which, in response to being excited by the blue light, emits red light, and a complex compound which absorbs light of a region in which the green light and the red light are mixed, the light of the region being included in white light implemented through a mixture of the green light and the red light excited together with the blue light.
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3.发明申请公开(公告)号：US20140213003A1
公开(公告)日：2014-07-31
申请号：US14228967
申请日：2014-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kun Yoo KO , Young June JEONG , Seung Hwan CHOI , Seong Ah JOO , Jung Kyu PARK
CPC classification number: H01L33/0075 , H01L33/32 , H01L33/486 , H01L33/62 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16
Abstract: The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form. Further, the present invention provides a method of manufacturing the GaN type LED device.
Abstract translation: 本发明涉及GaN型LED器件及其制造方法。 更具体地，提供了包括LED芯片的GaN型LED器件; 以及通过粘合剂层与LED芯片共晶结合的底座，其中，所述粘合层通过焊接多个金属层构成，其中第一金属层和第二金属层依次层叠，并且形成所述第二金属层 以糊状形式。 此外，本发明提供一种制造GaN型LED器件的方法。
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