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公开(公告)号：US09472740B2
公开(公告)日：2016-10-18
申请号：US14612049
申请日：2015-02-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong Wan Seo , Kun Yoo Ko , Jae Hee Lee
CPC classification number: H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48463 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) package may include a package body provided with a pair of lead frames, and an LED chip mounted on the package body and electrically connected to the lead frames through wire bonding. Each lead frame may include a first reflective layer disposed on a mounting surface on which the LED chip is disposed and a second reflective layer disposed on the first reflective layer. A wire may penetrate through the second reflective layer to be connected to the first reflective layer. Accordingly, the LED package may provide the uniform amount of light by suppressing discoloration of the lead frames, and the manufacturing time of the LED package may be reduced, leading to a reduction in manufacturing costs.
Abstract translation: 发光二极管（LED）封装可以包括设置有一对引线框的封装体和安装在封装主体上并通过引线接合电连接到引线框的LED芯片。 每个引线框架可以包括设置在其上设置LED芯片的安装表面上的第一反射层和设置在第一反射层上的第二反射层。 导线可穿透第二反射层以连接到第一反射层。 因此，LED封装可以通过抑制引线框架的变色来提供均匀的光量，并且可以减少LED封装的制造时间，导致制造成本的降低。
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公开(公告)号：US20160027977A1
公开(公告)日：2016-01-28
申请号：US14612049
申请日：2015-02-02
Applicant: SAMSUNG ELECTRONICS CO. LTD.
Inventor： Jong Wan SEO , Kun Yoo Ko , Jae Hee Lee
CPC classification number: H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48463 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) package may include a package body provided with a pair of lead frames, and an LED chip mounted on the package body and electrically connected to the lead frames through wire bonding. Each lead frame may include a first reflective layer disposed on a mounting surface on which the LED chip is disposed and a second reflective layer disposed on the first reflective layer. A wire may penetrate through the second reflective layer to be connected to the first reflective layer. Accordingly, the LED package may provide the uniform amount of light by suppressing discoloration of the lead frames, and the manufacturing time of the LED package may be reduced, leading to a reduction in manufacturing costs.
Abstract translation: 发光二极管（LED）封装可以包括设置有一对引线框的封装体和安装在封装主体上并通过引线接合电连接到引线框的LED芯片。 每个引线框架可以包括设置在其上设置LED芯片的安装表面上的第一反射层和设置在第一反射层上的第二反射层。 导线可穿透第二反射层以连接到第一反射层。 因此，LED封装可以通过抑制引线框架的变色来提供均匀的光量，并且可以减少LED封装的制造时间，导致制造成本的降低。
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公开(公告)号：US09190583B2
公开(公告)日：2015-11-17
申请号：US14558323
申请日：2014-12-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kun Yoo Ko , Masaaki Sofue
CPC classification number: H01L33/504 , C09K11/06 , G02B6/0068 , G02B6/0073 , H01L33/52 , H05B33/12
Abstract: A white light emitting device includes: a blue light emitting diode (LED) which emits blue light; and a resin packing unit which encapsulates the blue LED, wherein the resin packing unit includes a first wavelength conversion material which, in response to being excited by the blue light, emits green light, a second wavelength conversion material which, in response to being excited by the blue light, emits red light, and a complex compound which absorbs light of a region in which the green light and the red light are mixed, the light of the region being included in white light implemented through a mixture of the green light and the red light excited together with the blue light.
Abstract translation: 白色发光器件包括：蓝色发光二极管（LED），其发射蓝色光; 以及封装蓝色LED的树脂填充单元，其中，所述树脂填充单元包括响应于被蓝色光激发而发出绿色光的第一波长转换材料，响应于被激发的第二波长转换材料 通过蓝光发射红光，以及复合化合物，其吸收其中混合有绿光和红光的区域的光，该区域的光包含在通过绿光和 红光与蓝光一起激发。
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公开(公告)号：US08928220B2
公开(公告)日：2015-01-06
申请号：US13868628
申请日：2013-04-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kun Yoo Ko , Masaaki Sofue
CPC classification number: H01L33/504 , C09K11/06 , G02B6/0068 , G02B6/0073 , H01L33/52 , H05B33/12
Abstract: A white light emitting device includes: a blue light emitting diode (LED) which emits blue light; and a resin packing unit which encapsulates the blue LED, wherein the resin packing unit includes a first wavelength conversion material which, in response to being excited by the blue light, emits green light, a second wavelength conversion material which, in response to being excited by the blue light, emits red light, and a complex compound which absorbs light of a region in which the green light and the red light are mixed, the light of the region being included in white light implemented through a mixture of the green light and the red light excited together with the blue light.
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