公开(公告)号：US20180197919A1

公开(公告)日：2018-07-12

申请号：US15659343

申请日：2017-07-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beom Suk LEE ,  Kwang-Min LEE ,  Gwideok Ryan LEE ,  Masaru ISHll ,  Tae Yon LEE

IPC: H01L27/30 ,  H01L27/28 ,  H01L51/44

CPC classification number: H01L27/307 ,  H01L27/281 ,  H01L27/286 ,  H01L51/442 ,  Y02E10/549

Abstract: Image sensors according to some embodiments of the inventive concepts may include a pixel array are including a plurality of pixels, a peripheral area adjacent the pixel array unit, and an organic photoelectric converting layer including a first portion positioned on the pixel area and a second portion positioned on the peripheral area. The second portion may be separated from the first portion.

公开(公告)号：US20240243144A1

公开(公告)日：2024-07-18

申请号：US18455255

申请日：2023-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Min LEE ,  Kisang YOON

IPC: H01L27/146 ,  G02B1/116

CPC classification number: H01L27/1462 ,  G02B1/116 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14645 ,  H01L27/14685

Abstract: Provided is an image sensor, which includes a first substrate that has a first surface and a second surface opposite to the first surface, and includes a pixel array area and an edge area, the edge area including a first conductive pad; an anti-reflection structure on the second surface; a pixel isolator in the first substrate and defining and separating pixels; and a micro lens array that is disposed on the anti-reflection structure, in which the anti-reflection structure includes a first insulating layer, a conductive layer, a second insulating layer, and a third insulating layer sequentially stacked, the conductive layer is on the pixel array area, and is not at least in a portion of the edge area where the first conductive pad is arranged, and a voltage is configured to be applied to the conductive layer.

公开(公告)号：US20180204874A1

公开(公告)日：2018-07-19

申请号：US15696132

申请日：2017-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Min LEE ,  GwideokRyan LEE ,  SEOKJIN KWON ,  BEOMSUK LEE ,  TAEYON LEE ,  DONGMO IM

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14605 ,  H01L27/1461 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14636 ,  H04N9/045 ,  H04N9/07 ,  H04N2209/042

Abstract: An image sensor having active, peripheral and dummy regions is provided as follows. A dummy through electrode is disposed in the substrate. An active through electrode is disposed in the substrate. An insulation structure in which a color filter is embedded is disposed on the substrate. A dummy bottom electrode is disposed on the insulation structure and connected electrically to the dummy through electrode. An active bottom electrode is disposed on the insulation structure and connected electrically to the active through electrode. A photoelectric conversion layer is disposed on the insulation structure. A top electrode is disposed on the photoelectric conversion layer and the dummy bottom electrode. The top electrode is connected electrically to the dummy bottom electrode. The photoelectric conversion layer is interposed between the top electrode and the active bottom electrode which are separated from each other.

公开(公告)号：US20200251521A1

公开(公告)日：2020-08-06

申请号：US16857839

申请日：2020-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Min LEE ,  Seokjin KWON ,  Hyeyun PARK ,  Beomsuk LEE ,  Dongmo IM

IPC: H01L27/146 ,  H04N5/374

Abstract: An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.