公开(公告)号：US09716214B2

公开(公告)日：2017-07-25

申请号：US15147315

申请日：2016-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju-heon Yoon ,  Hak-hwan Kim ,  Dae-sup Kim ,  Jeong-hee Kim ,  Dong-myung Shin ,  Kwang-seok Yun

IPC: H01L33/16 ,  H01L33/38 ,  H01L33/62 ,  H05B33/08 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L33/16 ,  H01L33/20 ,  H01L33/38 ,  H05B33/086

Abstract: An LED package includes a substrate, a light-emitting structure provided on the substrate, an electrode structure provided on the light-emitting structure, and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis. The major axis of the external connection terminal is perpendicular to a cleaving plane of the substrate.