公开(公告)号：US20250105178A1

公开(公告)日：2025-03-27

申请号：US18634322

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： MinKi AHN ,  Kwangho LEE ,  Heeseok LEE ,  Jaegwon JANG ,  Heejung CHOI

IPC: H01L23/00

Abstract: A semiconductor chip according to an embodiment includes a semiconductor substrate, an interconnection pad on a first surface of the semiconductor substrate, an insulation layer being on the first surface of the semiconductor substrate and defining an opening that exposes at least a partial portion of the interconnection pad, a capping pad being on the insulation layer and being connected to the interconnection pad through the opening, and an insulation structure at a periphery of the capping pad on the insulation layer.

公开(公告)号：US20230034510A1

公开(公告)日：2023-02-02

申请号：US17965751

申请日：2022-10-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangho LEE ,  Cheulhee HAHM

IPC: G06F1/3206 ,  G06F1/3287 ,  H04L12/10 ,  H04W52/02 ,  H04L65/00

Abstract: An example electronic apparatus includes a communication circuitry; a power supply; a first processor configured to have a first mode which receives first power from the power supply and connects with a server through the communication circuitry to transmit and receive information, and a second mode which receives no power or second power lower than the first power from the power supply; and a second processor configured to repetitively output a mode switching signal within a preset range of time interval based on the second mode of the first processor, wherein the first processor is switched over to the first mode based on the mode switching signal, is configured to transmit connectivity keeping information to the server through the communication circuitry and is switched over to the second mode.

公开(公告)号：US20200341532A1

公开(公告)日：2020-10-29

申请号：US16960747

申请日：2019-01-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangho LEE ,  Cheulhee HAHM

IPC: G06F1/3206 ,  H04L12/10 ,  H04L29/02 ,  H04W52/02 ,  G06F1/3287

Abstract: Disclosed is an electronic apparatus, the electronic apparatus including: a communication circuitry; a power supply; a first processor configured to have a first mode which receives first power from the power supply and connects with a server through the communication circuitry to transmit and receive information, and a second mode which receives no power or second power lower than the first power from the power supply; and a second processor configured to repetitively output a mode switching signal within a preset range of time interval based on the second mode of the first processor, wherein the first processor is switched over to the first mode based on the mode switching signal, is configured to transmit connectivity keeping information to the server through the communication circuitry and is switched over to the second mode.

公开(公告)号：US20240274419A1

公开(公告)日：2024-08-15

申请号：US18529011

申请日：2023-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangho LEE ,  Sangki NAM ,  Jitae PARK ,  Seongjin IN ,  Keonhee LIM ,  Sungho JANG

IPC: H01J37/32

CPC classification number: H01J37/32972 ,  H01J37/32926

Abstract: A plasma monitoring system includes a chamber with an internal space configured to perform a plasma process on a semiconductor substrate, the chamber including a view window and a substrate stage, a light transmitter on the view window and including optical fibers configured to obtain a first light generated during the plasma process, a detachable reflection mirror between the view window and the optical fibers, a light generator configured to irradiate a second light onto the reflection mirror through the optical fibers and to irradiate a third light onto the view window through the optical fibers, and a light analyzer configured to obtain a light spectrum from the first light, to correct the light spectrum based on the second light reflected from the reflection mirror, and to correct the light spectrum based on the third light reflected from the view window.