SUBSTRATE PROCESSING APPARATUS
    2.
    发明公开

    公开(公告)号:US20240142886A1

    公开(公告)日:2024-05-02

    申请号:US18322161

    申请日:2023-05-23

    CPC classification number: G03F7/70908 G03F7/70716 H01L21/68

    Abstract: A substrate processing apparatus includes a table in an exposure chamber that is configured to perform an exposure process on a semiconductor substrate, a guiding device including a first horizontal driving body slidably movable in a first horizontal direction and a guide rail on the first horizontal driving body and having a trench extending in a second horizontal direction, a positioning device connected to the guiding device, the positioning device including a slider, a second horizontal driving body and a substrate stage, the slider configured to slidably move in the second horizontal direction along the trench, the second horizontal driving body connected or fixed to the slider, the substrate stage on the second horizontal driving body and configured to support the semiconductor substrate, and a blocking member between the guide rail and the substrate stage to block an inflow of foreign substances onto the substrate stage.

    Target debris collection device and extreme ultraviolet light source apparatus including the same

    公开(公告)号:US11599031B2

    公开(公告)日:2023-03-07

    申请号:US17555985

    申请日:2021-12-20

    Abstract: A target debris collection device for extreme ultraviolet (EUV) light source apparatus, includes a baffle body extending within an EUV vessel between a collector and an outlet port of the EUV vessel to allow EUV light reflected from the collector to pass through an internal transmissive region thereof, a discharge plate provided in a first end portion of the baffle body adjacent to the collector to collect the target material debris on an inner surface of the baffle body, a guide structure to guide the target material debris collected in the discharge plate to a collection tank, and a first heating member provided in the guide structure to prevent the target material debris from being solidified.

    ILLUMINATION CORRECTION APPARATUS
    6.
    发明公开

    公开(公告)号:US20240069443A1

    公开(公告)日:2024-02-29

    申请号:US18144622

    申请日:2023-05-08

    Abstract: An illumination correction apparatus for correcting a radiation beam incident on a reticle from an exposure apparatus includes a plurality of fingers each having a surface facing an incident direction of the radiation beam, the plurality of fingers being arranged in a first direction to be adjacent to a path of the radiation beam, and configured to adjust an amount of the incident radiation beam by moving in a second direction, intersecting the first direction, a controller connected to the plurality of fingers and configured to control movement of the plurality of fingers such that an intensity of the radiation beam has uniformity in the first direction, at least one optical sensor on the surface of at least one finger of the plurality of fingers, and a measurement unit configured to measure, based on an output of the at least one optical sensor, the intensity of the radiation beam.

    Apparatus for removing residue of EUV light source vessel

    公开(公告)号:US11822260B2

    公开(公告)日:2023-11-21

    申请号:US17939293

    申请日:2022-09-07

    CPC classification number: G03F7/70925 G03F7/70033 G03F7/7085 G03F7/70975

    Abstract: An apparatus for removing a residue of an EUV light source vessel including an internal side surface having a curved surface is provided. The apparatus includes a frame portion configured to be disposed on a bottom surface of an EUV light source vessel and a head portion above the frame portion. The head portion is configured to be rotatably moved on a circular trajectory while maintaining a desired (and/or alternatively predetermined) distance from the curved surface of the EUV light source vessel. The head portion may have a heating member configured to emit heat toward the curved surface of the EUV light source vessel. The heating member may have a shape curved in an arc corresponding to a portion of the circular trajectory.

    SUBSTRATE SUPPORTING APPARATUS
    10.
    发明公开

    公开(公告)号:US20240079264A1

    公开(公告)日:2024-03-07

    申请号:US18235603

    申请日:2023-08-18

    CPC classification number: H01L21/68742 H01L21/67288 H01L21/68785

    Abstract: A substrate supporting apparatus includes a stage table configured to support a substrate and including a plurality of openings, a plurality of lift pins disposed to be vertically movable through the plurality of openings and configured to support the substrate, a lift support positioned outside the stage table from a plan view and vertically movable to support the substrate, an actuator configured to vertically actuate the plurality of lift pins and the lift support so as to load the substrate onto the stage table, and a controller configured to control the actuator.

Patent Agency Ranking