公开(公告)号：US20140015129A1

公开(公告)日：2014-01-16

申请号：US14029394

申请日：2013-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Geun KIM ,  Dong-Chul HAN ,  Seok GOH ,  Jeong-Hoon KIM

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49811 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Abstract translation: 提供堆叠的包装和制造方法。 堆叠封装可以包括第一半导体封装，第二半导体封装，插头和间隔件。 第二半导体封装可以堆叠在第一半导体封装上。 插头可以将第一半导体电连接到第二半导体封装。 间隔件可以插入在第一半导体封装和第二半导体封装之间以在第一半导体封装和第二半导体封装之间形成间隙，从而防止插头之间的电短路。