公开(公告)号：US20130221383A1

公开(公告)日：2013-08-29

申请号：US13777962

申请日：2013-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soo Jeong LEE ,  Hyung Kun KIM

IPC: H01L33/60 ,  H01L33/08

CPC classification number: H01L33/60 ,  B82Y20/00 ,  B82Y30/00 ,  H01L33/08 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  Y10S977/762 ,  Y10S977/95 ,  H01L2924/00

Abstract: A light emitting diode (LED) package and a method of fabricating an LED package are provided. The LED package can include a transparent substrate and an LED arranged on the transparent substrate. A reflective layer and/or a polarizing layer can also be included. The LED may be disposed on one surface of the transparent substrate with the reflective layer and/or polarizing layer formed on an opposing surface of the transparent substrate. The fabrication method may include forming an LED on one surface of a transparent substrate by mounting a flip-chip on the transparent substrate or vapor-depositing the LED directly on the transparent substrate. A multi-package stacked structure can also be provided wherein a plurality of LED packages are stacked together unidirectionally or bidirectionally, with or without a reflective layer and/or a polarizing layer.

Abstract translation: 提供一种发光二极管（LED）封装以及制造LED封装的方法。 LED封装可以包括透明基板和布置在透明基板上的LED。 还可以包括反射层和/或偏振层。 LED可以设置在透明基板的一个表面上，其中反射层和/或偏振层形成在透明基板的相对表面上。 制造方法可以包括在透明基板的一个表面上形成LED，或者将透明基板上的倒装芯片安装在透明基板上，或者将LED直接气相沉积在透明基板上。 也可以提供多层封装堆叠结构，其中多个LED封装单向或双向堆叠在一起，具有或不具有反射层和/或偏振层。