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    SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体发光器件封装及其制造方法

    公开(公告)号：US20130320293A1

    公开(公告)日：2013-12-05

    申请号：US13908151

    申请日：2013-06-03

    申请人： Samsung Electronics Co., Ltd

    发明人： Jong Wan SEO ,  Hyung Kun KIM

    IPC分类号： H01L33/36 ,  H01L33/50

    CPC分类号： H01L33/36 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

    摘要： A semiconductor light emitting device package includes a base unit including a main body having electrical insulation properties and at least one pair of first and second through electrodes formed in the main body in a thickness direction thereof and formed of a semiconductor material, and a light emitting structure disposed on the base unit and including first and second conductivity type semiconductor layers and an active layer interposed there between. The manufacturing process thereof may be simplified, whereby a reduction in manufacturing costs and time may be achieved.

    摘要翻译： 一种半导体发光器件封装，包括：基底单元，包括具有电绝缘性的主体和至少一对第一和第二穿透电极，所述至少一对第一和第二穿透电极在其主体的厚度方向形成并由半导体材料形成， 结构，其设置在基本单元上并且包括第一和第二导电类型半导体层以及介于其间的有源层。 其制造方法可以简化，从而可以实现制造成本和时间的降低。

    LIGHT EMITTING DEVICE PACKAGE
    5.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开
    发光装置包装

    公开(公告)号：US20170069681A1

    公开(公告)日：2017-03-09

    申请号：US15200616

    申请日：2016-07-01

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Dong Kuk LEE ,  Yong Min KWON ,  Hyung Kun KIM

    IPC分类号： H01L27/15 ,  H01L33/54 ,  H01L33/20 ,  H01L33/46 ,  H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L33/38

    CPC分类号： H01L27/153 ,  H01L33/20 ,  H01L33/38 ,  H01L33/385 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

    摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.

    摘要翻译： 提供发光器件封装和制造发光器件封装的方法。 发光封装包括发光堆叠，其包括依次层叠的第一导电型半导体层，有源层，第二导电型半导体层，并且具有由第一导电型半导体层提供的第一表面和第二表面 由所述第二导电型半导体层提供并与所述第一表面相对; 第一电极结构，设置在所述第一表面的一部分上并连接到所述第一导电型半导体层; 设置在所述发光叠层附近的密封部; 设置在所述发光层与所述密封部之间的绝缘层; 以及第一金属焊盘，其设置在所述第二表面上并且在所述发光叠层的一侧穿过所述绝缘层以连接到所述第一电极结构。

    LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光器件封装及其制造方法

    公开(公告)号：US20160351755A1

    公开(公告)日：2016-12-01

    申请号：US15166254

    申请日：2016-05-26

    申请人： Samsung Electronics Co., Ltd.

    发明人： Dong Kuk LEE ,  Yong Min KWON ,  Hyung Kun KIM ,  Dae Yeop HAN

    IPC分类号： H01L33/46 ,  H01L33/00 ,  H01L33/38 ,  H01L33/06 ,  H01L33/32

    CPC分类号： H01L33/60 ,  H01L33/007 ,  H01L33/32 ,  H01L33/382 ,  H01L33/486 ,  H01L33/56 ,  H01L2933/0016 ,  H01L2933/005

    摘要： In one embodiment, a light emitting device package includes a light emitting device including a substrate and a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, stacked on the substrate; a reflective conductive layer provided on the light emitting structure; and a first electrode and a second electrode overlying the reflective conductive layer separated from each other in a first region. The first electrode and the second electrode are electrically insulated from the reflective metal layer and penetrate through the reflective metal layer to be electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively.

    摘要翻译： 在一个实施例中，发光器件封装包括发光器件，其包括衬底和堆叠在衬底上的包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 设置在发光结构上的反射导电层; 以及覆盖在第一区域中彼此分离的反射导电层的第一电极和第二电极。 第一电极和第二电极与反射金属层电绝缘，并且穿过反射金属层分别电连接到第一导电类型半导体层和第二导电类型半导体层。

    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
    7.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE 审中-公开
    制造半导体发光器件封装的方法

    公开(公告)号：US20160308089A1

    公开(公告)日：2016-10-20

    申请号：US14993066

    申请日：2016-01-11

    申请人： Samsung Electronics Co., Ltd.

    发明人： Hyung Kun KIM ,  Si Han KIM ,  Yu Seung KIM ,  Jung Jin KIM

    IPC分类号： H01L33/00 ,  H01L33/54 ,  H01L33/20 ,  H01L33/50

    CPC分类号： H01L33/0095 ,  H01L33/486 ,  H01L33/504 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

    摘要： Method of manufacturing a semiconductor light emitting device package are described. Semiconductor light emitting device packages includes may be formed by forming a plurality of light emitting diode chips having a structure in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially stacked on a wafer, forming a phosphor layer and an encapsulation layer on the first conductivity-type semiconductor layer, forming a texture on the encapsulation layer by removing a portion of the encapsulation layer from an upper surface thereof; and separating the plurality of light emitting diode chips from each other.

    摘要翻译： 描述制造半导体发光器件封装的方法。 半导体发光器件封装可以通过形成多个具有第一导电型半导体层，有源层和第二导电类型半导体层依次层叠在晶片上的结构的发光二极管芯片形成， 在所述第一导电型半导体层上形成荧光体层和封装层，通过从其上表面去除所述封装层的一部分，在所述封装层上形成纹理; 以及将所述多个发光二极管芯片彼此分离。

    TRANSPARENT LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEROF
    8.
    发明申请
    TRANSPARENT LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEROF 审中-公开
    透明发光二极管封装及其制造方法

    公开(公告)号：US20130221383A1

    公开(公告)日：2013-08-29

    申请号：US13777962

    申请日：2013-02-26

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Soo Jeong LEE ,  Hyung Kun KIM

    IPC分类号： H01L33/60 ,  H01L33/08

    CPC分类号： H01L33/60 ,  B82Y20/00 ,  B82Y30/00 ,  H01L33/08 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  Y10S977/762 ,  Y10S977/95 ,  H01L2924/00

    摘要： A light emitting diode (LED) package and a method of fabricating an LED package are provided. The LED package can include a transparent substrate and an LED arranged on the transparent substrate. A reflective layer and/or a polarizing layer can also be included. The LED may be disposed on one surface of the transparent substrate with the reflective layer and/or polarizing layer formed on an opposing surface of the transparent substrate. The fabrication method may include forming an LED on one surface of a transparent substrate by mounting a flip-chip on the transparent substrate or vapor-depositing the LED directly on the transparent substrate. A multi-package stacked structure can also be provided wherein a plurality of LED packages are stacked together unidirectionally or bidirectionally, with or without a reflective layer and/or a polarizing layer.

    摘要翻译： 提供一种发光二极管（LED）封装以及制造LED封装的方法。 LED封装可以包括透明基板和布置在透明基板上的LED。 还可以包括反射层和/或偏振层。 LED可以设置在透明基板的一个表面上，其中反射层和/或偏振层形成在透明基板的相对表面上。 制造方法可以包括在透明基板的一个表面上形成LED，或者将透明基板上的倒装芯片安装在透明基板上，或者将LED直接气相沉积在透明基板上。 也可以提供多层封装堆叠结构，其中多个LED封装单向或双向堆叠在一起，具有或不具有反射层和/或偏振层。

    METHOD OF MANUFACTURING SUBSTRATE FOR MOUNTING ELECTRONIC DEVICE
    9.
    发明申请
    METHOD OF MANUFACTURING SUBSTRATE FOR MOUNTING ELECTRONIC DEVICE 有权
    用于安装电子设备的基板的制造方法

    公开(公告)号：US20130157417A1

    公开(公告)日：2013-06-20

    申请号：US13722456

    申请日：2012-12-20

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Jong Wan SEO ,  Hyung Kun KIM

    IPC分类号： H01L21/50

    CPC分类号： H01L21/50 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a substrate for mounting an electronic device, includes forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof. An electrode substrate having at least one core on an upper surface thereof is formed such that the at least one core corresponds to the at least one through-hole. The electrode substrate is coupled to the substrate body by inserting the at least one core into the at least one through-hole. A portion of the coupled electrode substrate is removed except for the at least one core.

    摘要翻译： 一种制造用于安装电子装置的基板的方法，包括在板状基板主体的厚度方向上形成至少一个通孔。 在其上表面上具有至少一个芯的电极基板形成为使得至少一个芯对应于至少一个通孔。 通过将至少一个芯插入到至少一个通孔中，将电极基板连接到基板主体。 除了至少一个芯之外，除去耦合的电极基板的一部分。

    LIGHT EMITTING DEVICE MODULE
    10.
    发明申请
    LIGHT EMITTING DEVICE MODULE 审中-公开
    发光装置模块

    公开(公告)号：US20130092961A1

    公开(公告)日：2013-04-18

    申请号：US13651839

    申请日：2012-10-15

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Hyung Kun KIM ,  Sung Kyong OH

    IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L27/15

    CPC分类号： H01L33/507 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    摘要： According to example embodiments, a light emitting device (LED) module includes a substrate, a LED on the substrate, a first reflector on the substrate, and a phosphor structure contacting the first reflector. The first reflector may surround the LED from a plan view. The first reflector may have a width at a middle portion of the reflector that is smaller than a width at a bottom portion of the reflector. The LED module may obtain a desired view angle depending on various applications by adjusting a height of the first reflector and/or a difference between the height of first reflector and a height of a phosphor structure.

    摘要翻译： 根据示例性实施例，发光器件（LED）模块包括衬底，衬底上的LED，衬底上的第一反射器和与第一反射器接触的磷光体结构。 第一反射器可以从平面图围绕LED。 第一反射器可以在反射器的中间部分处具有小于反射器底部的宽度的宽度。 LED模块可以通过调整第一反射器的高度和/或第一反射体的高度与荧光体结构的高度之间的差异来取决于各种应用。