Abstract:
A semiconductor memory device includes a substrate including a memory cell region, a plurality of capacitor structures arranged in the memory cell region of the substrate and including a plurality of lower electrodes, a capacitor dielectric layer, and an upper electrode, a first support pattern contacting sidewalls of the plurality of lower electrodes of the plurality of capacitor structures to support the plurality of lower electrodes, and a second support pattern located at a higher vertical level than a vertical level of the first support pattern and contacting the sidewalls of the plurality of lower electrodes to support the plurality of lower electrodes. The plurality of lower electrodes have a plurality of recessed electrode portions, respectively, in upper portions of the plurality of lower electrodes.
Abstract:
A substrate heating apparatus includes: a plurality of heating lamps disposed on a chuck stage; a window disposed on the chuck stage and including a window base and a central lens, wherein the chuck stage and the window are each configured to support a substrate above the heating lamps; and a mirror disposed between the heating lamps and the chuck stage, the mirror including a mirror base, a central reflector, and an edge reflector, wherein the plurality of heating lamps are configured to heat the substrate by emitting light through the window onto the substrate and emitting light onto the mirror, wherein the mirror is configured to reflect the light through the window onto the substrate, including reflecting portions of the light via the central and edge reflectors, and wherein the central lens is configured to focus the light onto the central portion of the substrate.
Abstract:
A memory device includes a first write assist circuit providing a cell voltage or a write assist voltage to a first memory cell connected with a first bit line pair, a first write driver that provides write data to the first memory cell through the first bit line pair, a second write assist circuit that provides the cell voltage or the write assist voltage to a second memory cell connected with a second bit line pair, and a second write driver that provides write data to the second memory cell through the second bit line pair. One of the first and second write assist circuits provides the write assist voltage in response to a column selection signal for selecting one write driver, which provides write data, from among the first, and second write drivers, and the other thereof provides the cell voltage in response to the column selection signal.
Abstract:
Disclosed are an electronic apparatus and a method of controlling the same. The electronic apparatus includes a camera, a display, a memory, and a processor configured to execute at least one instruction to: detect a plurality of fingers in a plurality of first image frames obtained through the camera and, in response to an identification that a pose of the plurality of detected fingers corresponds to a trigger pose, enter a character input mode, detect a first motion of a finger among the plurality of fingers in a plurality of second image frames obtained through in the character input mode, identify a key corresponding to the first motion, from among a plurality of keys mapped to the finger, based on a position of the finger by the first motion and a reference point set to the finger, and control the display to display information corresponding to the identified key.
Abstract:
A wafer-cleaning apparatus includes an inner pin that supports a wafer. The wafer-cleaning apparatus further includes a nozzle disposed above the inner pin, a light source disposed under the inner pin, a window disposed between the light source and the wafer, and a window protector disposed between the wafer and the window. The nozzle supplies a chemical liquid to the wafer and the inner pin distributes a portion of the chemical liquid on an upper surface of the wafer by rotating the wafer. The window protector receives a portion of the chemical liquid that flows out of the wafer and the light source supplies the light to the wafer through the window protector and the window.
Abstract:
A substrate heating apparatus includes: a plurality of heating lamps disposed on a chuck stage; a window disposed on the chuck stage and including a window base and a central lens, wherein the chuck stage and the window are each configured to support a substrate above the heating lamps; and a mirror disposed between the heating lamps and the chuck stage, the mirror including a mirror base, a central reflector, and an edge reflector, wherein the plurality of heating lamps are configured to heat the substrate by emitting light through the window onto the substrate and emitting light onto the mirror, wherein the mirror is configured to reflect the light through the window onto the substrate, including reflecting portions of the light via the central and edge reflectors, and wherein the central lens is configured to focus the light onto the central portion of the substrate.
Abstract:
Disclosed are substrate drying methods, photoresist developing methods, and/or photolithography methods. The substrate drying method including providing a drying liquid on a substrate, increasing a pressure of the drying liquid to produce a supercritical fluid, and removing the supercritical fluid to dry the substrate may be provided.
Abstract:
A memory device includes a first write assist circuit providing a cell voltage or a write assist voltage to a first memory cell connected with a first bit line pair, a first write driver that provides write data to the first memory cell through the first bit line pair, a second write assist circuit that provides the cell voltage or the write assist voltage to a second memory cell connected with a second bit line pair, and a second write driver that provides write data to the second memory cell through the second bit line pair. One of the first and second write assist circuits provides the write assist voltage in response to a column selection signal for selecting one write driver, which provides write data, from among the first, and second write drivers, and the other thereof provides the cell voltage in response to the column selection signal.
Abstract:
An affective model device and a method of deciding the behavior of an affective model device are provided. The affective model device has affective components representing trait, attitude, mood, emotion, and the like. The affective model device updates the emotion at regular time intervals or when a stimulus is received, and decides the behavior based on the updated emotion. The emotion may be updated depending on trait, attitude, and mood.
Abstract:
A wafer-cleaning apparatus includes an inner pin that supports a wafer. The wafer-cleaning apparatus further includes a nozzle disposed above the inner pin, a light source disposed under the inner pin, a window disposed between the light source and the wafer, and a window protector disposed between the wafer and the window. The nozzle supplies a chemical liquid to the wafer and the inner pin distributes a portion of the chemical liquid on an upper surface of the wafer by rotating the wafer. The window protector receives a portion of the chemical liquid that flows out of the wafer and the light source supplies the light to the wafer through the window protector and the window.