公开(公告)号：US11039532B2

公开(公告)日：2021-06-15

申请号：US16439207

申请日：2019-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun Ha ,  Taeje Park

IPC: H05K1/02 ,  H01L23/00 ,  H01L21/02

Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

公开(公告)号：US11978836B2

公开(公告)日：2024-05-07

申请号：US17982229

申请日：2022-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun Ha ,  Jaehoo Park

IPC: H01L33/54 ,  B29C45/14 ,  B29C45/16 ,  B29L31/34 ,  H01L25/075

CPC classification number: H01L33/54 ,  B29C45/14065 ,  B29C45/1671 ,  H01L25/0753 ,  B29K2995/0026 ,  B29L2031/3475 ,  H01L2933/005

Abstract: A display module is provided that includes a substrate and a molding part. The substrate includes a first surface disposed with a plurality of LEDs, and a second surface, opposite of the first surface, that is disposed with a plurality of chips connected to the plurality of LEDs and further disposed with a coupling body. The molding part covers the first surface and the plurality of LEDs, and has a shape corresponding to a shape of the plurality of LEDs.

公开(公告)号：US11792924B2

公开(公告)日：2023-10-17

申请号：US17319633

申请日：2021-05-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun Ha ,  Taeje Park

IPC: H05K1/02 ,  H01L23/00 ,  H01L21/02

CPC classification number: H05K1/0289 ,  H01L21/02288 ,  H01L24/26 ,  H05K1/028

Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

公开(公告)号：US11527687B2

公开(公告)日：2022-12-13

申请号：US16869719

申请日：2020-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun Ha ,  Jaehoo Park

IPC: H01L33/54 ,  H01L25/075 ,  B29C45/14 ,  B29C45/16 ,  B29L31/34

Abstract: A method for molding a display module includes forming a cavity using a die plate of a first die and a plurality of side surface dies; filling the cavity with a coating material; fixing the display module to a second die using a coupling body disposed on a second surface of the display module, opposite of a first surface of the display module disposed with a plurality of LEDs; soaking the display module in the coating material filled in the cavity; curing the coating material; and separating the cured coating material of the display module from the die plate.