公开(公告)号：US20240231442A1

公开(公告)日：2024-07-11

申请号：US18617301

申请日：2024-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyun IM ,  Jaehoo Park ,  Joowhan Lee

IPC: G06F1/16 ,  H02K3/50 ,  H02K5/15

CPC classification number: G06F1/1658 ,  G06F1/1615 ,  G06F1/1698 ,  H02K3/50 ,  H02K5/15 ,  H02K2203/03

Abstract: A display apparatus includes a housing including a base; a motor coupled to the base; a rotating plate on one side of the base; a substrate on the rotating plate; inorganic light-emitting elements on the substrate, the inorganic light-emitting elements being bar shaped and extending in a radial direction from a center of the rotating plate; and a wireless module provided in the housing, the wireless module being configured to transmit and receive power and data to control the inorganic light-emitting elements, wherein the wireless module includes: a first coil; and a second coil inside the first coil or surrounding the first coil, the second coil being configured to generate an induced current due to current flowing in the first coil.

公开(公告)号：US09276087B2

公开(公告)日：2016-03-01

申请号：US14262937

申请日：2014-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungmin Kim ,  Sung-Dae Suk ,  Jaehoo Park ,  Dongho Cha ,  Daewon Ha

IPC: H01L21/84 ,  H01L29/66 ,  H01L21/02

CPC classification number: H01L29/66795 ,  H01L21/02233 ,  H01L21/308 ,  H01L21/76224 ,  H01L21/845 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/6656

Abstract: A method of manufacturing a semiconductor device includes patterning a substrate to form an active fin, forming a sacrificial gate pattern crossing over the active fin on the substrate, forming an interlayer insulating layer on the sacrificial gate pattern, removing the sacrificial gate pattern to form a gap region exposing the active fin in the interlayer insulating layer, and oxidizing a portion of the active fin exposed by the gap region to form an insulation pattern between the active fin and the substrate.

Abstract translation: 制造半导体器件的方法包括：图案化衬底以形成有源鳍片，形成与衬底上的有源鳍片交叉的牺牲栅极图案，在牺牲栅极图案上形成层间绝缘层，去除牺牲栅极图案以形成 间隙区域使层间绝缘层中的活性鳍片曝光，并且氧化由间隙区域暴露的活性鳍片的一部分，以在活性鳍片和衬底之间形成绝缘图案。

公开(公告)号：US12225182B2

公开(公告)日：2025-02-11

申请号：US18387706

申请日：2023-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyun Im ,  Jaehoo Park ,  Joowhan Lee

IPC: G09G3/00 ,  G09G3/32 ,  H04N13/393

Abstract: A display device includes a main body; a first rotatable shaft included in a first portion of the main body; a second rotatable shaft included in a second portion of the main body, the second portion being opposite to the first portion; a motor disposed inside the main body, and connected to at least one of the first rotatable shaft and the second rotatable shaft; a transparent wire including a first end connected to the first rotatable shaft and a second end connected to the second rotatable shaft; a plurality of light emitting diodes (LEDs) included inside the transparent wire in a longitudinal direction of the transparent wire; a driving circuit configured to drive the plurality of LEDs; and a processor configured to control the motor to rotate the transparent wire, and to provide an image frame to the driving circuit to display an image by rotation of the transparent wire.

公开(公告)号：US11978836B2

公开(公告)日：2024-05-07

申请号：US17982229

申请日：2022-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun Ha ,  Jaehoo Park

IPC: H01L33/54 ,  B29C45/14 ,  B29C45/16 ,  B29L31/34 ,  H01L25/075

CPC classification number: H01L33/54 ,  B29C45/14065 ,  B29C45/1671 ,  H01L25/0753 ,  B29K2995/0026 ,  B29L2031/3475 ,  H01L2933/005

Abstract: A display module is provided that includes a substrate and a molding part. The substrate includes a first surface disposed with a plurality of LEDs, and a second surface, opposite of the first surface, that is disposed with a plurality of chips connected to the plurality of LEDs and further disposed with a coupling body. The molding part covers the first surface and the plurality of LEDs, and has a shape corresponding to a shape of the plurality of LEDs.

公开(公告)号：US12048106B2

公开(公告)日：2024-07-23

申请号：US17745201

申请日：2022-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonggu Do ,  Jisoo Kim ,  Jaehoo Park ,  Minhee Lee ,  Sangkyun Im

IPC: H05K5/02 ,  H05K5/00

CPC classification number: H05K5/0217 ,  H05K5/0017

Abstract: A display apparatus including a front surface display panel including a side part that has a first mounting surface that is tilted, and at least one terminal arranged in the first mounting surface; a side surface display panel having a second mounting surface that is tilted so as to correspond to the first mounting surface, and the side surface display panel including at least one terminal arranged in the second mounting surface, wherein the side surface display panel is connected to the side part of the front surface display panel with the first mounting surface and the second mounting surface facing each other, and the at least one terminal arranged in the first mounting surface is electronically connected to the at least one terminal arranged in the second mounting surface, respectively, to electronically connect the front surface display panel and the side surface display panel.

公开(公告)号：US11527687B2

公开(公告)日：2022-12-13

申请号：US16869719

申请日：2020-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun Ha ,  Jaehoo Park

IPC: H01L33/54 ,  H01L25/075 ,  B29C45/14 ,  B29C45/16 ,  B29L31/34

Abstract: A method for molding a display module includes forming a cavity using a die plate of a first die and a plurality of side surface dies; filling the cavity with a coating material; fixing the display module to a second die using a coupling body disposed on a second surface of the display module, opposite of a first surface of the display module disposed with a plurality of LEDs; soaking the display module in the coating material filled in the cavity; curing the coating material; and separating the cured coating material of the display module from the die plate.

公开(公告)号：US12260808B2

公开(公告)日：2025-03-25

申请号：US18114017

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungryong Han ,  Jaeseok Kim ,  Jaehoo Park ,  Sangkyun Im ,  Kilsoo Jung

IPC: G09G3/32 ,  G09F9/302 ,  H01L25/075 ,  H01L27/15

Abstract: A transparent display module includes: a transparent substrate; a line pattern provided on the transparent substrate in a form of a two-dimensional grid; a plurality of micro-pixel integrated circuits (ICs) provided on the line pattern; a plurality of inorganic light emitting elements provided on the line pattern or the plurality of micro-pixel ICs; a plurality of transparent areas formed in areas in which the line pattern is not provided, and at least one pixel circuit configured to supply a driving current to the plurality of inorganic light emitting elements.

公开(公告)号：US09431522B2

公开(公告)日：2016-08-30

申请号：US15003288

申请日：2016-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungmin Kim ,  Sung-Dae Suk ,  Jaehoo Park ,  Dongho Cha ,  Daewon Ha

IPC: H01L21/84 ,  H01L29/66 ,  H01L21/02 ,  H01L21/308 ,  H01L21/762 ,  H01L29/06

CPC classification number: H01L29/66795 ,  H01L21/02233 ,  H01L21/308 ,  H01L21/76224 ,  H01L21/845 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/6656

Abstract: A method of manufacturing a semiconductor device includes patterning a substrate to form an active fin, forming a sacrificial gate pattern crossing over the active fin on the substrate, forming an interlayer insulating layer on the sacrificial gate pattern, removing the sacrificial gate pattern to form a gap region exposing the active fin in the interlayer insulating layer, and oxidizing a portion of the active fin exposed by the gap region to form an insulation pattern between the active fin and the substrate.

公开(公告)号：US20140335673A1

公开(公告)日：2014-11-13

申请号：US14262937

申请日：2014-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： SUNGMIN KIM ,  Sung-Dae Suk ,  Jaehoo Park ,  Dongho Cha ,  Daewon Ha

IPC: H01L29/66

CPC classification number: H01L29/66795 ,  H01L21/02233 ,  H01L21/308 ,  H01L21/76224 ,  H01L21/845 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/6656

Abstract: A method of manufacturing a semiconductor device includes patterning a substrate to form an active fin, forming a sacrificial gate pattern crossing over the active fin on the substrate, forming an interlayer insulating layer on the sacrificial gate pattern, removing the sacrificial gate pattern to form a gap region exposing the active fin in the interlayer insulating layer, and oxidizing a portion of the active fin exposed by the gap region to form an insulation pattern between the active fin and the substrate.

Abstract translation: 制造半导体器件的方法包括：图案化衬底以形成有源鳍片，形成与衬底上的有源鳍片交叉的牺牲栅极图案，在牺牲栅极图案上形成层间绝缘层，去除牺牲栅极图案以形成 间隙区域使层间绝缘层中的活性鳍片曝光，并且氧化由间隙区域暴露的活性鳍片的一部分，以在活性鳍片和衬底之间形成绝缘图案。