Abstract:
A light source assembly for a vehicle includes a frame having at least one device region; a heat radiator disposed above the at least one device region and spaced apart from the frame by a predetermined interval; a light source including at least one light emitting device disposed above the heat radiator in a position corresponding to the at least one device region; and an auxiliary heat radiator provided to the heat radiator by penetrating through the frame, thereby easily increasing and decreasing an amount of heat radiated by the heat radiator corresponding to an amount of heat generated by the light source.
Abstract:
A light source assembly includes a plurality of light source modules detachably connected to one another. Each light source module includes a frame part, an electrical connection part, and at least one light emitting device. The frame part includes a female coupling disposed in one side surface thereof and a male coupling disposed on another side surface thereof and configured to be engaged with a female coupling of another light source module of the plurality. The electrical connection part is disposed on an upper surface of the frame part and extends onto the one side surface having the female coupling disposed therein and onto the other side surface having the female coupling disposed thereon. The at least one light emitting device is mounted on the electrical connection part and disposed on the upper surface of the frame part.
Abstract:
A light source module is provided and includes a bracket having one or more fastening regions including a fastener. A heat radiator includes a fastening groove to which the fastener is fastened. A light source is disposed on the heat radiating part. The heat radiator may be detachably fastened to the one or more fastening regions when the fastening groove and the fastener are fastened to one another.
Abstract:
There is provided a semiconductor light emitting device including: a heat dissipation structure including one or more of materials among a metal, a ceramic, a semiconductor, and a resin; a flexible insulating layer directly in contact with the heat dissipation structure; a conductive layer laminated on the flexible insulating layer; and a light emitting device mounted on the conductive layer, wherein the light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, and the first electrode includes a plurality of conductive vias connected to the first conductivity-type semiconductor layer through the second conductivity-type semiconductor layer and the active layer.