公开(公告)号：US20150263253A1

公开(公告)日：2015-09-17

申请号：US14521103

申请日：2014-10-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwon-Jin KIM ,  Hee-Dong KIM ,  Hee-Seok PARK ,  Ji-Seok WANG ,  Yong-Kee JO

IPC: H01L33/60 ,  H01L33/50 ,  H01L27/15

CPC classification number: H01L33/60 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L33/50 ,  H01L33/504 ,  H01L33/54

Abstract: An LED package includes a package substrate, a first LED chip mounted on the package substrate, a first phosphor layer disposed on the first LED chip, a reflective layer configured to surround sides of the first LED chip and the first phosphor layer; and a mask disposed on the reflective layer and including a first opening portion which exposes a surface of the first phosphor layer.

Abstract translation: LED封装包括封装基板，安装在封装基板上的第一LED芯片，设置在第一LED芯片上的第一荧光体层，被配置为围绕第一LED芯片和第一荧光体层的侧面的反射层; 以及掩模，其设置在所述反射层上并且包括暴露所述第一荧光体层的表面的第一开口部。