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公开(公告)号:US20240094784A1
公开(公告)日:2024-03-21
申请号:US18470716
申请日:2023-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minhong DO , Yongwoon KIM , Eunsoo PARK , Jaebum BAE , Yonglak CHO
IPC: G06F1/16
CPC classification number: G06F1/1681
Abstract: According to an embodiment of the disclosure, an electronic device may comprise a housing including a first housing and a second housing configured to rotate relative to the first housing and a hinge module rotatably coupling the first housing and the second housing and received in the housing. The hinge module includes a hinge housing including a receiving space, a spring positioned in the receiving space of the hinge housing, a supporting member including an inclined portion coupled to one end of the spring, and a cam coupled to another end of the spring and configured to transfer force to the spring.
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公开(公告)号:US20230099993A1
公开(公告)日:2023-03-30
申请号:US18077804
申请日:2022-12-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jeongsik KIM , Muyeol LEE , Eunsoo PARK , Yonglak CHO , Jiwoo LEE
Abstract: An electronic device includes: a housing; a first camera module disposed in the housing, the first camera module including: a first camera housing; a prism disposed in the first camera housing and configured to refract light received from outside of the electronic device; and an image sensor disposed in the first camera housing and configured to obtain the light through the prism; and an antenna module configured to transmit or receive a signal, wherein at least a portion of the antenna module is disposed on the first camera module.
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公开(公告)号:US20250081422A1
公开(公告)日:2025-03-06
申请号:US18952435
申请日:2024-11-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Muyeol LEE , Eunsoo PARK , Byungwoo LEE , Jinwan AN , Jiwoo LEE , Yonggil HAN
Abstract: An electronic device may include: a printed circuit board; an electronic component disposed on one surface of the printed circuit board; a shield frame disposed on the one surface of the printed circuit board while surrounding the electronic component, the shield frame including a frame opening; a shielding sheet disposed on, directly or indirectly, one surface of the shield frame, and having at least a portion which is disposed in one direction of the frame opening of the shield frame to cover the frame opening; and a heat transfer material disposed between at least the electronic component and the shielding sheet. The shield frame may include an opening side area which may include: a first surface in which the shielding sheet is disposed; and a second surface opposite the first surface. In relation to the opening side area, a first surface of the opening side area may be spaced apart from the electronic component by a first length, and a second surface of the opening side area may be spaced apart from the electronic component by a second length that is longer than the first length.
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公开(公告)号:US20220164707A1
公开(公告)日:2022-05-26
申请号:US17528605
申请日:2021-11-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunsoo PARK
IPC: G06N20/00
Abstract: An electronic device may include a communicator and a processor configured to, based on characteristic information of a dataset for performing a job included in a queue, identify a type of a preloader configured to preload the dataset, and control the communicator to transmit the preloader of the identified type to at least one computing device among a plurality of computing devices. The job may be related to performing training of an AI model by using the dataset. The preloader of a first type may copy the dataset stored in at least one external storage device and store the dataset in the at least one computing device, and the preloader of a second type may generate a connecting link for the dataset stored in the at least one external storage and store the connecting link in the at least one computing device.
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公开(公告)号:US20230147727A1
公开(公告)日:2023-05-11
申请号:US18085582
申请日:2022-12-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hoyeon KIM , Jeongsik KIM , Eunsoo PARK , Hyuntae JUNG , Jinwan AN
IPC: H04B17/15 , H04M1/18 , H04B17/345
CPC classification number: H04B17/15 , H04M1/18 , H04B17/345
Abstract: An electronic device includes an antenna which transmits and receives a radio frequency (RF) signal, an RF circuit which processes the RF signal, and a control circuit which controls the RF circuit. The control circuit receives, from the RF circuit, a feedback signal, which the RF signal to be provided back as feedback from the antenna to the RF circuit, determines an impedance of the antenna based on the feedback signal, determines whether a water immersion of the electronic device occurs based on the determined impedance, and performs a set operation once it is determined that the water immersion of the electronic device occurs.
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公开(公告)号:US20210320417A1
公开(公告)日:2021-10-14
申请号:US17215585
申请日:2021-03-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Muyeol LEE , Jongyeon KIM , Eunsoo PARK , Woosup LEE , Sehwan CHOI , Jiwoo LEE
Abstract: An electronic device including an antenna is provided. The electronic device includes a housing including a front surface plate, a rear surface plate, and a side surface member, a printed circuit board positioned within the housing, a first support structure, a second support structure, a patch antenna including a flexible printed circuit board disposed on one surface of the first support structure that faces the rear surface plate, a first conductive patch, and a second conductive patch disposed to be spaced apart from the first conductive patch, a conductive pattern disposed on one surface of the second support structure, and a wireless communication circuit electrically connected with the patch antenna and the conductive pattern, and the first conductive patch, the second conductive patch and the conductive pattern are fed from the wireless communication circuit.
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公开(公告)号:US20250089215A1
公开(公告)日:2025-03-13
申请号:US18750244
申请日:2024-06-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungsoo JANG , Yongwoon KIM , Sangwon LEE , Eunsoo PARK , Jinwan AN
Abstract: An electronic device is disclosed. The electronic device includes a first shield can configured to accommodate an electronic component, a second shield can spaced apart from the first shield can, a heat dissipation structure comprising a heat dissipation material including an end connected to the first shield can and another end connected to the second shield can, and a thermally conductive material disposed in the heat dissipation structure, extending from at least a portion of an inner space of the first shield can to at least a portion of an inner space of the second shield can through the heat dissipation structure.
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公开(公告)号:US20240237247A1
公开(公告)日:2024-07-11
申请号:US18618428
申请日:2024-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yongwoon KIM , Eunsoo PARK , Doyun KIM , Jonghoon WOO
CPC classification number: H05K5/03 , H05K5/0226
Abstract: A foldable sheet of an embodiment may include a body area including a first body and a second body spaced apart from the first body, a folding area positioned between the first body and the second body and folded in a first direction so that the first body and the second body face each other, a bending area including a first bending area for connecting one end of the folding area and the first body, and a second bending area for connecting the other end of the folding area and the second body. The bending area may have a structure which is bent at least twice to protrude in a second direction opposite to the first direction so that the first body and the second body are arranged in parallel to each other in a state where the folding area is unfolded.
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公开(公告)号:US20230420973A1
公开(公告)日:2023-12-28
申请号:US18310111
申请日:2023-05-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jinyoung JANG , Jimyung HA , Eunsoo PARK , Yonggil HAN
CPC classification number: H02J7/00716 , G06F1/28 , H02J7/00304 , H02J7/0013
Abstract: An electronic device includes: at least one processor, a first battery, a second battery, a first sensing integrated circuit (IC) configured to identify a measurement value of a total charging current for charging the first battery and the second battery through a first sensing resistor connected to the first battery and the second battery, and a second sensing IC configured to identify a second charging current value for the second battery through a second sensing resistor connected to the second battery. The at least one processor may be configured to set the total charging current to a first value. The at least one processor may be configured to set the total charging current to a second value, the second value being less than the first value, based on identifying a first charging current value greater than a first reference value or the second charging current value greater than a second reference value.
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公开(公告)号:US20240188218A1
公开(公告)日:2024-06-06
申请号:US18438124
申请日:2024-02-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yonglak CHO , Joohan KIM , Juho KIM , Min PARK , Eunsoo PARK , Insun AN , Byungwoo LEE , Sangtae LEE , Haejin LEE
CPC classification number: H05K1/144 , H05K3/284 , H05K1/181 , H05K2201/042 , H05K2201/09063 , H05K2201/10378 , H05K2201/10545
Abstract: A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.
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