公开(公告)号：US20160072098A1

公开(公告)日：2016-03-10

申请号：US14785580

申请日：2013-10-31

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Chang Min LEE ,  Se Il OH ,  Sung Min KO ,  Ji Hye KWON ,  Seong Ryong NAM ,  Yeon Soo LEE ,  Ji Yeon LEE ,  Seung Jib CHOI ,  Kyoung Jin HA

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00 ,  C09K11/06

CPC classification number: H01L51/5256 ,  C09K11/06 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1033 ,  C09K2211/181 ,  H01L27/3244 ,  H01L51/004 ,  H01L51/0058 ,  H01L51/0071 ,  H01L51/5253 ,  H01L51/56

Abstract: The present invention relates to a photo-curing composition comprising (A) a photo-curable monomer, (B) a light-emitting substance, and (C) an initiator, wherein the light-emitting substance has a maximum light-emitting wavelength of about 400 to 500 nm during irradiation at a wavelength of 300-480 nm, and an encapsulated device comprising the same.

Abstract translation: 本发明涉及一种光固化组合物，其包含（A）光固化性单体，（B）发光物质和（C）引发剂，其中，所述发光物质的最大发光波长为 在波长为300-480nm的照射期间约400至500nm，以及包含其的封装装置。

公开(公告)号：US20150364690A1

公开(公告)日：2015-12-17

申请号：US14736677

申请日：2015-06-11

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Seong Ryong NAM ,  Ji Yeon LEE ,  Kyoung Jin HA ,  Sung Min KO

IPC: H01L51/00 ,  C09D135/02

CPC classification number: H01L51/5256 ,  C08F222/1006 ,  C08F2222/1026 ,  C09D133/04 ,  C09D133/06 ,  Y10T428/1059 ,  Y10T428/1077

Abstract: A composition for encapsulating an organic light emitting diode device and an organic light emitting diode display, the composition including a di(meth)acrylate including an unsubstituted alkylene group, a tri(meth)acrylate including a substituted or unsubstituted alkylene group or a substituted or unsubstituted alkyl group, and a photo-initiator, wherein the composition for encapsulating the organic light emitting diode device has a chloride content of about 200 ppm or less.

Abstract translation: 用于封装有机发光二极管器件和有机发光二极管显示器的组合物，所述组合物包含包含未取代的亚烷基的二（甲基）丙烯酸酯，包含取代或未取代的亚烷基的三（甲基）丙烯酸酯或取代或未取代的亚烷基 未取代的烷基和光引发剂，其中用于封装有机发光二极管器件的组合物的氯化物含量为约200ppm以下。

公开(公告)号：US20190181276A1

公开(公告)日：2019-06-13

申请号：US16002026

申请日：2018-06-07

Applicant: Samsung SDI Co., Ltd.

Inventor： Sang Hee PARK ,  Sung Il MOON ,  Kyoung Jin HA

IPC: H01L31/0224 ,  H01B1/22

Abstract: A solar cell includes a silicon substrate and an electrode on the silicon substrate. The silicon substrate includes at least 5 raised portions having a cross-sectional height (h) of about 50 nm or more per 5 μm length. The electrode is formed from a composition for solar cell electrodes having a water contact angle of about 15° to about 60°.

公开(公告)号：US20170149016A1

公开(公告)日：2017-05-25

申请号：US15129924

申请日：2015-04-09

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Seong Ryong NAM ,  Ji Yeon LEE ,  Kyoung Jin HA ,  Sung Min KO ,  Han Sung YU

IPC: H01L51/52 ,  C08F230/08

CPC classification number: H01L51/5256 ,  C08F222/1006 ,  C08F230/08 ,  C08F2230/085 ,  C08F2222/1013 ,  C08F2220/301

Abstract: A composition for encapsulation of an organic light emitting diode and an organic light emitting diode display manufactured using the same. The composition for encapsulation includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate; about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate; about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate; and about 1 wt % to about 10 wt % of (D) an initiator, wherein the (B) silicon-based di(meth)acrylate is represented by Formula 1.

公开(公告)号：US20150280151A1

公开(公告)日：2015-10-01

申请号：US14671110

申请日：2015-03-27

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Seong Ryong NAM ,  Chang Soo WOO ,  Chang Min LEE ,  Sung Min KO ,  Han Sung YU ,  Ji Yeon LEE ,  Kyoung Jin HA

IPC: H01L51/00 ,  C08L33/14

CPC classification number: H01L51/0094 ,  C08F290/068 ,  C08G77/20 ,  C08G77/442 ,  C08G77/80 ,  C08L33/14 ,  C08L43/04 ,  C09D183/10 ,  H01L51/0043 ,  H01L51/5256 ,  C08F222/10

Abstract: A composition for encapsulation of an organic light emitting diode comprising a photocurable monomer, a silicon-containing monomer, and an initiator, wherein the silicon-containing monomer is represented by Formula 1, and an organic light emitting diode display are disclosed.

Abstract translation: 公开了一种用于封装包含光固化单体，含硅单体和引发剂的有机发光二极管的组合物，其中含硅单体由式1表示，有机发光二极管显示器。

公开(公告)号：US20150048334A1

公开(公告)日：2015-02-19

申请号：US14336234

申请日：2014-07-21

Applicant: Samsung SDI Co., Ltd.

Inventor： Ji Yeon LEE ,  Sung Min KO ,  Seong Ryong NAM ,  Se Il OH ,  Seung Jib CHOI ,  Kyoung Jin HA

IPC: C08F222/20 ,  H01L51/00

CPC classification number: C08F222/20 ,  C08F2/48 ,  C08F230/02 ,  C08F230/08 ,  H01L33/56 ,  H01L51/0043 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/5256 ,  C08F2220/1891 ,  C08F2222/1013

Abstract: A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more, Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)−(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)×100.  

Abstract translation: 光固化性组合物，有机发光二极管的封装用组合物和胶囊化装置，其中，在A表示玻璃基板与Ni / Fe合金之间的玻璃 - 金属合金模具剪切强度（kgf）时， 固化后，B表示如下式1所示的固化收缩率，光固化性组合物的A / B值为约0.7kgf /％以上，玻璃 - 金属合金模具剪切强度为约2.5kgf 以上的固化收缩率=固化后的固体光固化性组合物的比重 - 固化前的液体光固化性组合物的比重| /（固化前的液体光固化性组合物的比重）×100。 <等式1>