Abstract:
Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, two adjacent inorganic layers at least partially contact each other, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes a photocurable monomer and a photopolymerization initiator. The photocurable monomer includes a monomer containing no aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups represented by Formula 1. The photocurable monomer includes about 5 wt % to about 45 wt % of the monomer having two or more substituted or unsubstituted phenyl groups and about 55 wt % to about 95 wt % of the monomer containing no aromatic hydrocarbon group.
Abstract:
Disclosed is an organic light emitting display device including a substrate, an organic light emitting element formed on the substrate, and an encapsulation layer encapsulating the organic light emitting element, wherein the encapsulation layer has a structure in which at least two inorganic layers and at least one organic layer are alternately stacked one above another, each of the inorganic layers having a thickness of about 40 nm to about 1,000 nm and an index of refraction of about 1.41 to about 2.0, each of the organic layer having a thickness of about 0.2 μm to about 15 μm and an index of refraction of about 1.4 to about 1.65, the organic layer including a composition for encapsulating a display device, the composition for encapsulating a display device including a photocurable monomer and a photopolymerization initiator.
Abstract:
Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, each of the inorganic layers has a thickness of about 40 nm to about 1000 nm and an index of refraction of about 1.41 to about 2.0, each of the organic layers has a thickness of about 0.2 μm to about 15 μm and an index of refraction of about 1.4 to about 1.65, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate, about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate, about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate, and about 1 wt % to about 10 wt % of (D) an initiator, the (B) silicon-based di(meth)acrylate being represented by Formula 1.
Abstract:
A composition for encapsulation of organic light emitting diodes and an organic light emitting diode display apparatus, the composition including photocurable monomers and having a CLD of 50 or more, as calculated by Equation 1: CLD = ∑ M x ( N x - 1 ) M total [ Equation 1 ] wherein, in Equation 1, Mtotal is a total sum of a number of moles of the photocurable monomers in the composition, Mx is a number of moles of an xth photocurable monomer in the composition, Nx is a number of photocurable functional groups per mole of the xth photocurable monomer in the composition, and x is an integer of 1 or more.
Abstract:
A display sealing material composition includes a photopolymerization initiator and a photocuring monomer, the photocuring monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups. An organic protection layer obtained by curing the composition for a display sealing material has approximately 400 nm/min or less plasma etching rate being represented by formula 1 below and approximately 2 nm or less surface roughness. Plasma etching rate(nm/min)=(T0−T1)/M, wherein T0, T1, and M are set forth in the specification.
Abstract:
A composition for encapsulation of an organic light emitting diode comprising a photocurable monomer, a silicon-containing monomer, and an initiator, wherein the silicon-containing monomer is represented by Formula 1, and an organic light emitting diode display are disclosed.
Abstract:
A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more, Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)−(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)×100.
Abstract:
Provided is an organic light emitting display comprising: a substrate including a light emitting zone and a non-light emitting zone, which is positioned around the outside of the light emitting zone; at least one organic light emitting diode formed on the light emitting zone; an encapsulation layer for sealing the organic light emitting diode; and a dam formed on the non-light emitting zone, wherein the encapsulation layer includes a structure in which at least one inorganic layer and at least one organic layer are alternatingly stacked, wherein the organic layer is made from a display sealing material composition, and wherein the display sealing material composition comprises a photo-curable monomer and a photopolymerization initiator. The photo-curable monomer comprises: a monomer not having an aromatic hydrocarbon group; and a monomer, represented by chemical formula 1, having at least two substituted or non-substituted phenyl groups, wherein the photo-curable monomer comprises approximately 5 wt. % to 45 wt. % of the monomer having the at least two substituted or non-substituted phenyl groups, and approximately 55 wt. % to 95 wt. % of a monomer not having the aromatic hydrocarbon group.
Abstract:
Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, two adjacent inorganic layers at least partially contact each other, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate, about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate, about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate, and about 1 wt % to about 10 wt % of (D) an initiator, the (B) silicon-based di(meth)acrylate being represented by Formula 1.
Abstract:
The present invention relates to a photo-curing composition comprising (A) a photo-curable monomer, (B) a light-emitting substance, and (C) an initiator, wherein the light-emitting substance has a maximum light-emitting wavelength of about 400 to 500 nm during irradiation at a wavelength of 300-480 nm, and an encapsulated device comprising the same.