公开(公告)号：US20180294251A1

公开(公告)日：2018-10-11

申请号：US15620471

申请日：2017-06-12

Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

Inventor： Yangming Liu ,  Chin-Tien Chiu ,  Zhongli Ji ,  Shaopeng Dong ,  Zengyu Zhou

IPC: H01L25/065 ,  H01L25/10 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/071 ,  H01L25/074 ,  H01L25/0756 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.

公开(公告)号：US10236276B2

公开(公告)日：2019-03-19

申请号：US15620471

申请日：2017-06-12

Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

Inventor： Yangming Liu ,  Chin-Tien Chiu ,  Zhongli Ji ,  Shaopeng Dong ,  Zengyu Zhou

IPC: H01L25/10 ,  H01L25/04 ,  H01L25/07 ,  H01L25/11 ,  H01L25/065 ,  H01L25/00 ,  H01L25/075

Abstract: A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.